公开(公告)号：US20240234270A1

公开(公告)日：2024-07-11

申请号：US18395626

申请日：2023-12-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG ,  OMin KWON

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/552 ,  H01L25/16

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/5383 ,  H01L23/552 ,  H01L25/165 ,  H01L24/16 ,  H01L2224/16225

Abstract: A semiconductor device and a method for making the same are provided. The method includes: providing a substrate having a first surface and a second surface opposite to the first surface, wherein a plurality of conductive pillars are formed on the second surface of the substrate; forming a polyimide layer on the second surface of the substrate to cover the plurality of conductive pillars; mounting a first electronic component on the first surface of the substrate; and forming a first encapsulant on the first surface of the substrate to cover the first electronic component.

公开(公告)号：US20240055368A1

公开(公告)日：2024-02-15

申请号：US18447315

申请日：2023-08-10

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG ,  OMin KWON

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L21/565

Abstract: A semiconductor device and a method for making the same are provided. The semiconductor device includes: a substrate; an electronic component mounted on the substrate; a first encapsulant disposed on the substrate and encapsulating the electronic component; and a first electromagnetic interference (EMI) shielding layer disposed on the first encapsulant, wherein the first EMI shielding layer includes a first plurality of shield protrusions each having one or more inclined sidewalls.