公开(公告)号：US20240120291A1

公开(公告)日：2024-04-11

申请号：US18482849

申请日：2023-10-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG

IPC: H01L23/552 ,  H01L21/56 ,  H01L21/66 ,  H01L23/31 ,  H01L23/544

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L22/12 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/544 ,  H01L2223/54453

Abstract: A semiconductor device and a method for making the same are provided. The method includes: providing a package including: a substrate including a top substrate surface and a bottom substrate surface; an electronic component mounted on the top substrate surface; and a first encapsulant disposed on the top substrate surface and encapsulating the electronic component; forming a fiducial mark in the first encapsulant; and forming a first shielding layer on the first encapsulant using an aerosol jetting apparatus, wherein the first shielding layer is at a predetermined distance from the fiducial mark and above the electronic component.

公开(公告)号：US20240347477A1

公开(公告)日：2024-10-17

申请号：US18633538

申请日：2024-04-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56

Abstract: A method for forming a shielding layer over a semiconductor package is provided. The method comprises: providing a jig having a metal frame and a carrier tape attached onto the metal frame via an adhesive layer; forming an opening through the adhesive layer and the carrier tape; disposing a semiconductor package on the jig over the opening such that the semiconductor package is supported on and attached to the carrier tape via the adhesive layer; forming a groove in the adhesive layer and around the opening by isotropic etching; forming a shielding layer over the semiconductor package and the jig; and removing the semiconductor package with the shielding layer from the jig.

公开(公告)号：US20250125158A1

公开(公告)日：2025-04-17

申请号：US18914058

申请日：2024-10-12

Applicant: STATS ChipPAC Pte. Ltd

Inventor： YongHyuk JEONG ,  JinHee JUNG ,  GwangTae KIM

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373

Abstract: A method for attaching a heat spreader to a semiconductor package is provided. The method comprises: providing a semiconductor package, wherein the semiconductor package comprises a package substrate, a semiconductor component mounted on the package substrate and a mold cap formed on the package substrate and encapsulating the semiconductor component, and wherein the mold cap comprises a laser-activatable mold compound; removing a portion of a thickness of the mold cap above the semiconductor component by laser ablation to form a cavity in the mold cap and transform the laser-activatable mold compound at an inner surface of the cavity to a conductive layer; dispensing a thermal interface material (TIM) in the cavity to form on the conductive layer a TIM layer that protrudes from the mold cap; and attaching the heater spreader to the semiconductor package at least through the TIM layer.

公开(公告)号：US20240332151A1

公开(公告)日：2024-10-03

申请号：US18605841

申请日：2024-03-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee JUNG ,  ChangOh KIM

IPC: H01L23/498 ,  H01L21/32 ,  H01L21/48 ,  H01L23/00 ,  H01L23/552 ,  H01L25/065

CPC classification number: H01L23/49822 ,  H01L21/32 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/05 ,  H01L24/29 ,  H01L25/0652 ,  H01L2224/05005 ,  H01L2224/05025 ,  H01L2224/29005 ,  H01L2224/29021 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/182 ,  H01L2924/3025

Abstract: An integrated package and a method for making the same are provided. The integrated package may include: a substate; a first electronic component mounted on the substrate; a first dielectric layer formed on the substrate and covering the first electric component, wherein the dielectric layer is made of photo imageable dielectric material; a first redistribution layer formed in the first dielectric layer, wherein the first redistribution layer includes a first vertical portion running through the first dielectric layer and a first lateral portion formed on a top surface of the first dielectric layer; a second electronic component mounted above the first dielectric layer and coupled with the lateral portion of the first redistribution layer; and a second dielectric layer formed above the first dielectric layer and covering the second electronic component.

公开(公告)号：US20240250062A1

公开(公告)日：2024-07-25

申请号：US18414500

申请日：2024-01-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee JUNG ,  ChangOh KIM ,  HeeSoo LEE

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/82 ,  H01L21/561 ,  H01L24/24 ,  H01L25/0655 ,  H01L25/50 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3185 ,  H01L2224/24137 ,  H01L2224/245 ,  H01L2224/82005 ,  H01L2224/82103 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: A method for making a semiconductor device is provided. The method includes: providing a semiconductor assembly comprising a first semiconductor die and a second semiconductor die, wherein a first interconnection structure is electrically coupled to the first semiconductor die and a second interconnection structure is electrically coupled to the second semiconductor die; depositing an encapsulant layer over the semiconductor assembly to encapsulate the first interconnection structure and the second interconnection structure, wherein the encapsulant layer comprises an additive activatable by laser; forming an interconnection channel in the encapsulant layer and activating the additive of the encapsulant layer in the interconnection channel as a seed layer by laser patterning, wherein the interconnection channel exposes and interconnects the first and the second interconnection structures; forming a conductive layer in the interconnection channel of the encapsulant layer; and forming an outer layer on the encapsulant layer to cover the conductive layer.

公开(公告)号：US20240387309A1

公开(公告)日：2024-11-21

申请号：US18661773

申请日：2024-05-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee JUNG ,  ChangOh KIM ,  WooSoon KIM

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/552

Abstract: An electronic package is provided. The electronic package includes: a substrate comprising a substrate surface, and a first set of conductive patterns and a second set of conductive patterns on the substrate surface; at least one electronic component attached on the substrate surface and electrically connected to the second set of conductive patterns; an encapsulant layer encapsulating the at least one electronic component and exposing the first set of conductive patterns; and a shielding layer formed over the encapsulant layer and not over the first set of conductive patterns, wherein the shielding layer is formed of a conductive ink cured by ultraviolet light.

公开(公告)号：US20240339394A1

公开(公告)日：2024-10-10

申请号：US18605842

申请日：2024-03-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee JUNG ,  ChangOh KIM

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L23/49894 ,  H01L21/56 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/13016 ,  H01L2224/16227

Abstract: A partially shielded semiconductor device and a method for making the same are provided. The method may include: providing a package including: a substrate; an electronic component mounted on the substrate; an encapsulant formed on the substrate and encapsulating the electronic component; and a coating layer formed on the substrate and adjacent to the encapsulant; performing a laser hatching process on the encapsulant and a portion of the coating layer adjacent to the encapsulant to remove the portion of the coating layer to form a trench between the encapsulant and the coating layer; and electroless-plating a conductive material to cover the encapsulant and fill the trench between the encapsulant and the coating layer.

公开(公告)号：US20240234270A1

公开(公告)日：2024-07-11

申请号：US18395626

申请日：2023-12-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG ,  OMin KWON

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/552 ,  H01L25/16

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/5383 ,  H01L23/552 ,  H01L25/165 ,  H01L24/16 ,  H01L2224/16225

Abstract: A semiconductor device and a method for making the same are provided. The method includes: providing a substrate having a first surface and a second surface opposite to the first surface, wherein a plurality of conductive pillars are formed on the second surface of the substrate; forming a polyimide layer on the second surface of the substrate to cover the plurality of conductive pillars; mounting a first electronic component on the first surface of the substrate; and forming a first encapsulant on the first surface of the substrate to cover the first electronic component.

公开(公告)号：US20240055368A1

公开(公告)日：2024-02-15

申请号：US18447315

申请日：2023-08-10

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh KIM ,  JinHee JUNG ,  OMin KWON

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L21/565

Abstract: A semiconductor device and a method for making the same are provided. The semiconductor device includes: a substrate; an electronic component mounted on the substrate; a first encapsulant disposed on the substrate and encapsulating the electronic component; and a first electromagnetic interference (EMI) shielding layer disposed on the first encapsulant, wherein the first EMI shielding layer includes a first plurality of shield protrusions each having one or more inclined sidewalls.