公开(公告)号：US20230413453A1

公开(公告)日：2023-12-21

申请号：US18459624

申请日：2023-09-01

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Kang Dong KIM ,  Chang Hoon HAN ,  Chul Ho YOON ,  Ho Byung KIM ,  Hyun Woo KIM ,  Gun Woo SHIN

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/103 ,  H05K3/3405 ,  H05K1/181 ,  H05K2203/0502 ,  H05K2201/08

Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.