公开(公告)号：US20230413453A1

公开(公告)日：2023-12-21

申请号：US18459624

申请日：2023-09-01

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Kang Dong KIM ,  Chang Hoon HAN ,  Chul Ho YOON ,  Ho Byung KIM ,  Hyun Woo KIM ,  Gun Woo SHIN

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/103 ,  H05K3/3405 ,  H05K1/181 ,  H05K2203/0502 ,  H05K2201/08

Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

公开(公告)号：US20230187120A1

公开(公告)日：2023-06-15

申请号：US18164060

申请日：2023-02-03

Applicant: STEMCO CO., LTD.

Inventor： Kang Dong KIM ,  Chang Hoon HAN ,  Hyun Woo KIM ,  Su Jeong SHIN

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F2027/2809

Abstract: Provided is a coil substrate having an asymmetric structure, in which the area of a coil pattern included in a first region is expanded relative to the area of a coil pattern included in a second region with respect to a virtual axis, and an electronic apparatus having the same. The coil substrate comprises a base layer; and a coil pattern spirally wound on the base layer, wherein an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern, wherein an area of the coil pattern formed in the second region is larger than an area of the coil pattern formed in the first region.