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公开(公告)号：US09648724B2
公开(公告)日：2017-05-09
申请号：US14956512
申请日：2015-12-02
Applicant: STMICROELECTRONICS (CROLLES 2) SAS , STMICROELECTRONICS SA
Inventor： Nicolas Hotellier , François Guyader , Vincent Fiori , Richard Fournel , Frédéric Gianesello
IPC: H05K1/02 , H05K1/11 , H05K1/18 , H05K3/00 , H01L21/762 , H01L21/764
CPC classification number: H05K1/0216 , H01L21/762 , H01L21/7624 , H01L21/764 , H01L24/03 , H01L24/05 , H01L29/0657 , H01L2224/02166 , H01L2224/04042 , H01L2924/00014 , H05K1/111 , H05K1/181 , H05K3/0011 , H01L2224/05599
Abstract: An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.
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公开(公告)号：US09998699B2
公开(公告)日：2018-06-12
申请号：US15077023
申请日：2016-03-22
Applicant: STMICROELECTRONICS (CROLLES 2) SAS
Inventor： François Guyader , François Roy
CPC classification number: H04N5/3742 , H01L27/14614 , H01L27/14623 , H01L27/14629 , H01L27/1463 , H01L27/14634 , H01L27/1464 , H01L27/14643 , H04N5/353 , H04N5/378
Abstract: A global shutter image sensor of a back-illuminated type includes a semiconductor substrate and pixels. Each pixel includes a photosensitive area, a storage area, a readout area and areas for transferring charges between these different areas. The image sensor includes, for each pixel, a protector extending at least partly into the substrate from the back of the substrate to ensure that the storage area is protected against back illumination.
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