公开(公告)号：US20240081160A1

公开(公告)日：2024-03-07

申请号：US18506383

申请日：2023-11-10

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Philippe BOIVIN ,  Simon JEANNOT

IPC: H10N70/20 ,  H10B63/00 ,  H10N70/00

CPC classification number: H10N70/231 ,  H10B63/30 ,  H10B63/80 ,  H10N70/011 ,  H10N70/061 ,  H10N70/253 ,  H10N70/823 ,  H10N70/826 ,  H10N70/8265 ,  H10N70/8413 ,  H10N70/8828 ,  G11C13/0004

Abstract: A memory cell includes a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element. The memory cell is formed in a wafer comprising a semiconductor substrate covered with a first insulating layer, the insulating layer being covered with an active layer made of a semiconductor. The gate is formed on the active layer and has a lateral flank covered with a second insulating layer. The variable-resistance element includes a first layer covering a lateral flank of the active layer in a trench formed through the active layer along the lateral flank of the gate and reaching the first insulating layer, and a second layer made of a variable-resistance material.

公开(公告)号：US20180330780A1

公开(公告)日：2018-11-15

申请号：US15978003

申请日：2018-05-11

Applicant: STMICROELECTRONICS (ROUSSET) SAS

Inventor： Philippe BOIVIN ,  Simon JEANNOT ,  Olivier WEBER

IPC: G11C13/00 ,  H01L45/00

Abstract: The disclosure relates to a memory cell comprising a resistive RAM memory element and a selection transistor, in which the memory element is positioned on a flank of the selection transistor.

公开(公告)号：US20190214434A1

公开(公告)日：2019-07-11

申请号：US16357152

申请日：2019-03-18

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Philippe BOIVIN ,  Simon JEANNOT

IPC: H01L27/24 ,  H01L45/00

CPC classification number: H01L27/2436 ,  G11C13/0004 ,  G11C2213/79 ,  G11C2213/82 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/085 ,  H01L45/1226 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1666

Abstract: The disclosure relates to a memory cell formed in a wafer comprising a semiconductor substrate covered with a first insulating layer, the insulating layer being covered with an active layer made of a semiconductor, the memory cell comprising a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element, the gate being formed on the active layer and having a lateral flank covered with a second insulating layer, the variable-resistance element being formed by a layer of variable-resistance material, deposited on a lateral flank of the active layer in a first trench formed through the active layer along the lateral flank of the gate, a trench conductor being formed in the first trench against a lateral flank of the layer of variable-resistance material.

公开(公告)号：US20210280779A1

公开(公告)日：2021-09-09

申请号：US17328917

申请日：2021-05-24

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Philippe BOIVIN ,  Simon JEANNOT

IPC: H01L45/00 ,  H01L27/24

Abstract: A memory cell includes a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element. The memory cell is formed in a wafer comprising a semiconductor substrate covered with a first insulating layer, the insulating layer being covered with an active layer made of a semiconductor. The gate is formed on the active layer and has a lateral flank covered with a second insulating layer. The variable-resistance element includes a first layer covering a lateral flank of the active layer in a trench formed through the active layer along the lateral flank of the gate and reaching the first insulating layer, and a second layer made of a variable-resistance material.

公开(公告)号：US20190326510A1

公开(公告)日：2019-10-24

申请号：US16457855

申请日：2019-06-28

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Philippe BOIVIN ,  Simon JEANNOT

IPC: H01L45/00 ,  H01L27/24

Abstract: A memory cell includes a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element. The memory cell is formed in a wafer comprising a semiconductor substrate covered with a first insulating layer, the insulating layer being covered with an active layer made of a semiconductor. The gate is formed on the active layer and has a lateral flank covered with a second insulating layer. The variable-resistance element includes a first layer covering a lateral flank of the active layer in a trench formed through the active layer along the lateral flank of the gate and reaching the first insulating layer, and a second layer made of a variable-resistance material.