公开(公告)号：US20150138420A1

公开(公告)日：2015-05-21

申请号：US14086507

申请日：2013-11-21

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  David Gani ,  Wee Chin Judy Lim ,  Bs Aw ,  Cheng-Hai Cheh

IPC: H04N5/225 ,  G02F1/1341 ,  G02F1/1345 ,  G02F1/1333 ,  G02F1/1343

CPC classification number: H04N5/2257 ,  G02F1/13452 ,  G03B3/10 ,  G03B5/00 ,  G03B17/02 ,  G03B2205/0046 ,  Y10T29/49117

Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.

Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。

公开(公告)号：US09671671B2

公开(公告)日：2017-06-06

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wee Chin Judy Lim ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  G02F1/35 ,  B23K1/00 ,  B23K101/38

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

公开(公告)号：US20150103297A1

公开(公告)日：2015-04-16

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE. LTD

Inventor： WeeChinJudy LIM ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  B23K31/02 ,  B32B37/24 ,  B23K1/00

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

Abstract translation: 光学组件可以包括衬底，由衬底承载的壳体，并且在其上表面中具有至少一个粘合剂容纳凹部，以及由壳体承载的透镜。 光学组件还可以包括与透镜相邻的液晶聚焦单元，并且包括与其相关联的单元层和导电触点对。 所述光学组件还可以包括至少一个导电构件，在所述至少一个粘合剂容纳凹部内并且将每对所述导电触点连接在一起，并且所述至少一个粘合剂容纳凹部中的粘合体覆盖所述至少一个 导电部件。

公开(公告)号：US09244334B2

公开(公告)日：2016-01-26

申请号：US13853598

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。

公开(公告)号：US20140293120A1

公开(公告)日：2014-10-02

申请号：US13853598

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。