公开(公告)号：US09671671B2

公开(公告)日：2017-06-06

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wee Chin Judy Lim ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  G02F1/35 ,  B23K1/00 ,  B23K101/38

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

公开(公告)号：US09244334B2

公开(公告)日：2016-01-26

申请号：US13853598

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。

公开(公告)号：US20150138420A1

公开(公告)日：2015-05-21

申请号：US14086507

申请日：2013-11-21

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  David Gani ,  Wee Chin Judy Lim ,  Bs Aw ,  Cheng-Hai Cheh

IPC: H04N5/225 ,  G02F1/1341 ,  G02F1/1345 ,  G02F1/1333 ,  G02F1/1343

CPC classification number: H04N5/2257 ,  G02F1/13452 ,  G03B3/10 ,  G03B5/00 ,  G03B17/02 ,  G03B2205/0046 ,  Y10T29/49117

Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.

Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。

公开(公告)号：US20130248887A1

公开(公告)日：2013-09-26

申请号：US13845445

申请日：2013-03-18

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS PTE LTD

Inventor： Romain Coffy ,  Eric Saugier ,  Hk Looi ,  Norbert Chevrier

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S17/026 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94026 ,  H03K2217/94112 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。

公开(公告)号：US20140293120A1

公开(公告)日：2014-10-02

申请号：US13853598

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。

公开(公告)号：US09105766B2

公开(公告)日：2015-08-11

申请号：US13845445

申请日：2013-03-18

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics Pte Ltd

Inventor： Romain Coffy ,  Eric Saugier ,  Hk Looi ,  Norbert Chevrier

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  G01S17/02 ,  H01L25/16 ,  H03K17/94 ,  G01S7/481 ,  H03K17/945

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S17/026 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94026 ,  H03K2217/94112 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。

公开(公告)号：US20150103297A1

公开(公告)日：2015-04-16

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE. LTD

Inventor： WeeChinJudy LIM ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  B23K31/02 ,  B32B37/24 ,  B23K1/00

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

Abstract translation: 光学组件可以包括衬底，由衬底承载的壳体，并且在其上表面中具有至少一个粘合剂容纳凹部，以及由壳体承载的透镜。 光学组件还可以包括与透镜相邻的液晶聚焦单元，并且包括与其相关联的单元层和导电触点对。 所述光学组件还可以包括至少一个导电构件，在所述至少一个粘合剂容纳凹部内并且将每对所述导电触点连接在一起，并且所述至少一个粘合剂容纳凹部中的粘合体覆盖所述至少一个 导电部件。

公开(公告)号：US08779443B2

公开(公告)日：2014-07-15

申请号：US13629379

申请日：2012-09-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong ,  Hk Looi

IPC: H01L27/15

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

公开(公告)号：US20140084308A1

公开(公告)日：2014-03-27

申请号：US13629379

申请日：2012-09-27

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Wing Shenq Wong ,  Hk Looi

IPC: H01L33/48

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。