公开(公告)号：US20170263565A1

公开(公告)日：2017-09-14

申请号：US15068741

申请日：2016-03-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Raquel FUNDAN

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4871 ,  H01L21/4875 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45664 ,  H01L2924/00014

Abstract: An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding wire is within the encapsulated body and has a proximal end coupled to the substrate and a distal end exposed on an outer surface of the encapsulated body. An electrically conductive shield layer is on the outer surface of the encapsulated body and in contact with the exposed distal end of the at least one grounding wire.