公开(公告)号：US20180006182A1

公开(公告)日：2018-01-04

申请号：US15199390

申请日：2016-06-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  H01S5/022 ,  H01L31/12 ,  H01L31/042 ,  H01G9/20 ,  H01L31/0475 ,  H01L31/047 ,  H01S5/183 ,  H01L31/046

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20190288155A1

公开(公告)日：2019-09-19

申请号：US16430928

申请日：2019-06-04

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  G01S7/481 ,  G01S17/08 ,  H01L31/0236 ,  H01L31/0203 ,  H01L31/047 ,  H01L31/042 ,  H01L31/046 ,  H01L31/0475 ,  H01G9/20 ,  H01S5/183 ,  H01L31/12 ,  H01S5/022

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20220368100A1

公开(公告)日：2022-11-17

申请号：US17712932

申请日：2022-04-04

Applicant: STMicroelectronics PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01S5/026 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0239 ,  G02F1/01 ,  H01S5/183

Abstract: An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

公开(公告)号：US20180151772A1

公开(公告)日：2018-05-31

申请号：US15880090

申请日：2018-01-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  H01L31/12 ,  H01G9/20 ,  H01L31/046 ,  H01S5/183 ,  H01S5/022 ,  H01L31/042 ,  H01L31/0475 ,  H01L31/047

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183 ,  Y02E10/50

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20240030115A1

公开(公告)日：2024-01-25

申请号：US18352962

申请日：2023-07-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/42

CPC classification number: H01L23/49811 ,  H01L24/32 ,  H01L24/48 ,  H01L23/3107 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/1306 ,  H01L2924/01029 ,  H01L2924/182

Abstract: The present disclosure is directed to a power package with copper plating terminals. The power package includes at least two terminals coupled to a semiconductor die. An area of a first terminal is greater than an area of a second terminal. The first and second terminals extend to a first and second conductive layers in a backside of the package. A third conductive layer is coupled to a backside surface of the die that is coplanar with the first and second conductive layers. The terminals and conductive layers are copper plating. A first molding compound covers the die and terminals, while a second molding compound fills distances between the die and the extensions of the terminals. The copper plating and the molding compounds enhance the performance of the packaged device in a high-power circuit. In addition, robustness of the package is enhanced compared with conventional packages including wire bonding.

公开(公告)号：US20170263565A1

公开(公告)日：2017-09-14

申请号：US15068741

申请日：2016-03-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Raquel FUNDAN

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4871 ,  H01L21/4875 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45664 ,  H01L2924/00014

Abstract: An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding wire is within the encapsulated body and has a proximal end coupled to the substrate and a distal end exposed on an outer surface of the encapsulated body. An electrically conductive shield layer is on the outer surface of the encapsulated body and in contact with the exposed distal end of the at least one grounding wire.