Vertical MOS semiconductor device for high-frequency applications, and related manufacturing process
    3.
    发明授权
    Vertical MOS semiconductor device for high-frequency applications, and related manufacturing process 有权
    用于高频应用的垂直MOS半导体器件及相关制造工艺

    公开(公告)号:US09508846B2

    公开(公告)日:2016-11-29

    申请号:US14662652

    申请日:2015-03-19

    Abstract: A MOS semiconductor device of a vertical type has: a functional layer, having a first type of conductivity; gate structures, which are formed above the functional layer and have a region of dielectric material and an electrode region; body wells, which have a second type of conductivity, are formed within the functional layer, and are separated by a surface separation region; source regions, which have the first type of conductivity and are formed within the body wells. Each gate structure extends laterally above just one respective body well and does not overlap the surface separation region of the functional layer. The device may further have: at least one shield structure, arranged between adjacent gate structures above the surface separation region; and/or at least one doped control region, having the second type of conductivity, arranged within the surface separation region, which are both set at the source potential.

    Abstract translation: 垂直型的MOS半导体器件具有:具有第一类导电性的功能层; 栅极结构,其形成在功能层上方并具有介电材料区域和电极区域; 具有第二类导电性的主体孔形成在功能层内,并被表面分离区分离; 源区,其具有第一类导电性并形成在体孔内。 每个栅极结构横向仅在一个相应的主体阱上方延伸,并且不与功能层的表面分离区域重叠。 该装置还可以具有:至少一个屏蔽结构,布置在表面分离区域上方的相邻门结构之间; 和/或具有第二类型导电性的至少一个掺杂控制区域,布置在表面分离区域内,两者都被设置在源极电位。

    VERTICAL MOS SEMICONDUCTOR DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND RELATED MANUFACTURING PROCESS
    5.
    发明申请
    VERTICAL MOS SEMICONDUCTOR DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND RELATED MANUFACTURING PROCESS 有权
    用于高频应用的垂直MOS半导体器件及相关制造工艺

    公开(公告)号:US20150303300A1

    公开(公告)日:2015-10-22

    申请号:US14662652

    申请日:2015-03-19

    Abstract: A MOS semiconductor device of a vertical type has: a functional layer, having a first type of conductivity; gate structures, which are formed above the functional layer and have a region of dielectric material and an electrode region; body wells, which have a second type of conductivity, are formed within the functional layer, and are separated by a surface separation region; source regions, which have the first type of conductivity and are formed within the body wells. Each gate structure extends laterally above just one respective body well and does not overlap the surface separation region of the functional layer. The device may further have: at least one shield structure, arranged between adjacent gate structures above the surface separation region; and/or at least one doped control region, having the second type of conductivity, arranged within the surface separation region, which are both set at the source potential.

    Abstract translation: 垂直型的MOS半导体器件具有:具有第一类导电性的功能层; 栅极结构,其形成在功能层上方并具有介电材料区域和电极区域; 具有第二类导电性的主体孔形成在功能层内,并被表面分离区分离; 源区,其具有第一类导电性并形成在体孔内。 每个栅极结构横向仅在一个相应的主体阱上方延伸,并且不与功能层的表面分离区域重叠。 该装置还可以具有:至少一个屏蔽结构,布置在表面分离区域上方的相邻门结构之间; 和/或具有第二类型导电性的至少一个掺杂控制区域,布置在表面分离区域内,两者都被设置在源极电位。

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