公开(公告)号：US20170297906A1

公开(公告)日：2017-10-19

申请号：US15638001

申请日：2017-06-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Barbara SIMONI ,  Carlo VALZASINA ,  Lorenzo CORSO

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00 ,  H02K41/02

CPC classification number: B81B7/0074 ,  B81B7/007 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/093 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.

公开(公告)号：US20160091528A1

公开(公告)日：2016-03-31

申请号：US14964469

申请日：2015-12-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Barbara SIMONI ,  Carlo VALZASINA

IPC: G01P15/18

CPC classification number: G01P15/18 ,  G01C19/574 ,  G01P15/125

Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.

公开(公告)号：US20160145096A1

公开(公告)日：2016-05-26

申请号：US14971639

申请日：2015-12-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Barbara SIMONI ,  Carlo VALZASINA ,  Lorenzo CORSO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B7/007 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/093 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.

Abstract translation: 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。