公开(公告)号：US20180056319A1

公开(公告)日：2018-03-01

申请号：US15803630

申请日：2017-11-03

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon DODD ,  Joe SCHEFFELIN ,  Dave HUNT ,  Matt GIERE ,  Dana GRUENBACHER ,  Faiz SHERMAN

IPC: B05B17/06 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  B41J2/14 ,  B41J2/16

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US20170297332A1

公开(公告)日：2017-10-19

申请号：US15636491

申请日：2017-06-28

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon DODD ,  Joe SCHEFFELIN ,  Dave HUNT ,  Matt GIERE ,  Dana GRUENBACHER ,  Faiz SHERMAN

IPC: B41J2/14 ,  B05B17/06

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US20160107443A1

公开(公告)日：2016-04-21

申请号：US14976434

申请日：2015-12-21

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana GRUENBACHER ,  Faiz SHERMAN

IPC: B41J2/14

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US20160101619A1

公开(公告)日：2016-04-14

申请号：US14975540

申请日：2015-12-18

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon DODD ,  Joe SCHEFFELIN ,  Dave HUNT ,  Matt GIERE ,  Dana GRUENBACHER ,  Faiz SHERMAN

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US20160101429A1

公开(公告)日：2016-04-14

申请号：US14975200

申请日：2015-12-18

Applicant: STMicroelectronics, Inc.

Inventor： Simon Dodd ,  Joseph Edward Scheffelin ,  Dave S. Hunt ,  Timothy James HOEKSTRA ,  Faiz SHERMAN ,  Stephan Gary Bush

IPC: B05B9/00 ,  B05B9/03 ,  A61L9/03 ,  B05B1/14

CPC classification number: A61L9/03 ,  A61L2/00 ,  A61L9/00 ,  B05B17/0684

Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.

Abstract translation: 一个或多个实施方案涉及分配流体的微流体递送系统。 微流体递送系统可以以各种方向提供。 在一个实施例中，微流体输送系统是垂直的，使得被排出的流体与重力相反。 在另一个实施方案中，微流体递送系统侧向定向，使得被排出的流体具​​有水平分量。 在另一个实施方案中，微流体递送系统面向下。