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公开(公告)号：US11084283B2
公开(公告)日：2021-08-10
申请号：US16676070
申请日：2019-11-06
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico Giusti , Marco Ferrera , Carlo Luigi Prelini , Simon Dodd
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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公开(公告)号：US10123491B2
公开(公告)日：2018-11-13
申请号：US14985128
申请日：2015-12-30
Applicant: STMicroelectronics, Inc.
Inventor： Marco De Fazio , Simon Dodd
Abstract: The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.
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公开(公告)号：US09968700B2
公开(公告)日：2018-05-15
申请号：US14975200
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joseph Edward Scheffelin , Dave S. Hunt , Timothy James Hoekstra , Faiz Sherman , Stephan Gary Bush
CPC classification number: A61L9/03 , A61L2/00 , A61L9/00 , B05B17/0684
Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.
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公开(公告)号：US20180050901A1
公开(公告)日：2018-02-22
申请号：US15240709
申请日：2016-08-18
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US11242242B2
公开(公告)日：2022-02-08
申请号：US16422504
申请日：2019-05-24
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico Giusti , Simon Dodd
Abstract: A microfluidic MEMS device is formed by a plurality of ejection cells each having a fluid chamber; an actuator chamber; a membrane having a first surface facing the actuator chamber and a second surface facing the fluid chamber; a piezoelectric actuator on the first surface of the membrane; and a passivation layer on the piezoelectric actuator. The membrane has an elongated area defining a longitudinal direction and a transverse direction. The passivation layer has a plurality of holes. The holes extend throughout the thickness of the passivation layer and, in a plan view, have an elongated shape with a greater dimension parallel to the longitudinal direction of the membrane and a smaller dimension parallel to the transverse direction.
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Patent Agency Ranking
公开(公告)号：US10759169B2
公开(公告)日：2020-09-01
申请号：US16357100
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNAITONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10357964B2
公开(公告)日：2019-07-23
申请号：US15917231
申请日：2018-03-09
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS (MALTA) LTD
Inventor： Simon Dodd , Ivan Ellul , Christopher Brincat
Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
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公开(公告)号：US10159150B2
公开(公告)日：2018-12-18
申请号：US15253615
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Roberto Brioschi
Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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公开(公告)号：US10118391B2
公开(公告)日：2018-11-06
申请号：US15253618
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC.
Inventor： Simon Dodd
IPC: B41J2/14
Abstract: The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.
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公开(公告)号：US09919334B2
公开(公告)日：2018-03-20
申请号：US14975540
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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