公开(公告)号：US10131147B2

公开(公告)日：2018-11-20

申请号：US14941898

申请日：2015-11-16

Applicant: STMICROELECTRONICS, INC.

Inventor： Kenneth J. Stewart

IPC: B41J2/16 ,  B41J2/14 ,  H01L21/78 ,  B41J2/145 ,  B28D5/02

Abstract: A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.

公开(公告)号：US09744766B2

公开(公告)日：2017-08-29

申请号：US14985984

申请日：2015-12-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Kenneth J. Stewart

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/16 ,  B41J2/1635 ,  B41J2202/20

Abstract: A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, continuous slotted recesses in a first surface of a wafer. The continuous slotted recesses may be arranged in parallel, spaced apart relation, and each continuous slotted recess may extend continuously across the first surface. The method may further include forming discontinuous slotted recesses in a second surface of the wafer to be aligned and coupled in communication with the continuous slotted recesses to define alternating through-wafer channels and slotted recess portions. The method may further include selectively filling the residual slotted recess portions to define through-wafer ink channels.

公开(公告)号：US09409394B2

公开(公告)日：2016-08-09

申请号：US13906466

申请日：2013-05-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Kenneth J. Stewart

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/16 ,  B41J2/1635 ,  B41J2202/20

Abstract: A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, continuous slotted recesses in a first surface of a wafer. The continuous slotted recesses may be arranged in parallel, spaced apart relation, and each continuous slotted recess may extend continuously across the first surface. The method may further include forming discontinuous slotted recesses in a second surface of the wafer to be aligned and coupled in communication with the continuous slotted recesses to define alternating through-wafer channels and slotted recess portions. The method may further include selectively filling the residual slotted recess portions to define through-wafer ink channels.

Abstract translation: 制造喷墨打印头的方法可以包括通过用旋转锯片锯切在晶片的第一表面中形成连续的狭槽。 连续的开槽凹槽可以平行布置，间隔开的关系，并且每个连续的开槽凹槽可以连续延伸穿过第一表面。 该方法可以进一步包括在晶片的第二表面中形成不连续的开槽的凹槽，以与待连接的开槽的凹槽对准和耦合，以限定交替的晶片通道和开槽凹部。 该方法还可以包括选择性地填充剩余的开槽凹部以限定贯穿晶片墨水通道。

公开(公告)号：US10124588B2

公开(公告)日：2018-11-13

申请号：US14984672

申请日：2015-12-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Murray J. Robinson ,  Kenneth J. Stewart

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/045

Abstract: A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.

公开(公告)号：US09346273B2

公开(公告)日：2016-05-24

申请号：US13906477

申请日：2013-05-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Kenneth J. Stewart

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/145 ,  B28D5/02

CPC classification number: B41J2/1632 ,  B28D5/022 ,  B28D5/027 ,  B41J2/14112 ,  B41J2/14129 ,  B41J2/145 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1635 ,  B41J2002/14491 ,  H01L21/78 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/49798

Abstract: A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.

Abstract translation: 制造喷墨打印头的方法可以包括通过用旋转锯片锯切在晶片的第一表面中形成第一不连续的开槽凹槽。 第一不连续的开槽凹槽可以以平行的，间隔的关系布置。 该方法可以进一步包括通过与旋转锯片锯切形成在晶片的第二表面中的第二不连续开槽的凹槽，其与第一连续开槽的凹槽对准并耦合以限定贯穿晶片通道。 在另一个实施例中，第一和第二多个不连续凹槽可以由相应的第一和第二旋转锯片形成。

公开(公告)号：US20190047289A1

公开(公告)日：2019-02-14

申请号：US16165484

申请日：2018-10-19

Applicant: STMicroelectronics, Inc.

Inventor： Murray J. Robinson ,  Kenneth J. Stewart

IPC: B41J2/14 ,  B41J2/045 ,  B41J2/16

Abstract: A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.

公开(公告)号：US09340023B2

公开(公告)日：2016-05-17

申请号：US13906447

申请日：2013-05-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Paul I. Mikulan ,  Kenneth J. Stewart ,  Virgina L. Hwang

IPC: B41J2/16

CPC classification number: B41J2/1603 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2/1639 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/49401

Abstract: A method of making inkjet print heads may include forming a first wafer including a sacrificial substrate layer, and a first dielectric layer thereon having first openings therein defining inkjet orifices. The method may also include forming a second wafer having inkjet chambers defined thereon, and joining the first and second wafers together so that each inkjet orifice is aligned with a respective inkjet chamber. The method may further include removing the sacrificial substrate layer thereby defining the inkjet print heads.

Abstract translation: 制造喷墨打印头的方法可以包括形成包括牺牲基底层的第一晶片和其上具有限定喷墨孔的第一开口的第一介电层。 该方法还可以包括形成具有限定在其上的喷墨室的第二晶片，并且将第一和第二晶片接合在一起，使得每个喷墨孔与相应的喷墨室对准。 该方法还可以包括去除牺牲衬底层从而限定喷墨打印头。

公开(公告)号：US20140354736A1

公开(公告)日：2014-12-04

申请号：US13906466

申请日：2013-05-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Kenneth J. Stewart

IPC: B41J2/045 ,  B41J2/175

CPC classification number: B41J2/1433 ,  B41J2/16 ,  B41J2/1635 ,  B41J2202/20

Abstract: A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, continuous slotted recesses in a first surface of a wafer. The continuous slotted recesses may be arranged in parallel, spaced apart relation, and each continuous slotted recess may extend continuously across the first surface. The method may further include forming discontinuous slotted recesses in a second surface of the wafer to be aligned and coupled in communication with the continuous slotted recesses to define alternating through-wafer channels and slotted recess portions. The method may further include selectively filling the residual slotted recess portions to define through-wafer ink channels.

Abstract translation: 制造喷墨打印头的方法可以包括通过用旋转锯片锯切在晶片的第一表面中形成连续的狭槽。 连续的开槽凹槽可以平行布置，间隔开的关系，并且每个连续的开槽凹槽可以连续延伸穿过第一表面。 该方法可以进一步包括在晶片的第二表面中形成不连续的开槽的凹槽，以与待连接的开槽的凹槽对准和耦合，以限定交替的晶片通道和开槽凹部。 该方法还可以包括选择性地填充剩余的开槽凹部以限定贯穿晶片墨水通道。

公开(公告)号：US10308023B2

公开(公告)日：2019-06-04

申请号：US15664668

申请日：2017-07-31

Applicant: STMicroelectronics, Inc.

Inventor： Kenneth J. Stewart

IPC: B41J2/16 ,  B41J2/14

Abstract: An inkjet print head includes a semiconductor substrate having a plurality of continuous slotted recesses in a first surface. The plurality of continuous slotted recesses is arranged in parallel, spaced apart relation. Each continuous slotted recess extends continuously across the first surface. The semiconductor substrate also has a plurality of discontinuous slotted recesses in a second surface that is opposite the first surface. The plurality of discontinuous slotted recesses is aligned and coupled in communication with the continuous slotted recesses to have a first portion defining a plurality of alternating through-wafer channels and a second portion defining residual slotted recess portions. A dielectric material is disposed within the residual slotted recess portions. A plurality of inkjet heaters is carried by said semiconductor substrate.

公开(公告)号：US20170326878A1

公开(公告)日：2017-11-16

申请号：US15664668

申请日：2017-07-31

Applicant: STMicroelectronics, Inc.

Inventor： Kenneth J. Stewart

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/16 ,  B41J2/1635 ,  B41J2202/20

Abstract: An inkjet print head includes a semiconductor substrate having a plurality of continuous slotted recesses in a first surface. The plurality of continuous slotted recesses is arranged in parallel, spaced apart relation. Each continuous slotted recess extends continuously across the first surface. The semiconductor substrate also has a plurality of discontinuous slotted recesses in a second surface that is opposite the first surface. The plurality of discontinuous slotted recesses is aligned and coupled in communication with the continuous slotted recesses to have a first portion defining a plurality of alternating through-wafer channels and a second portion defining residual slotted recess portions. A dielectric material is disposed within the residual slotted recess portions. A plurality of inkjet heaters is carried by said semiconductor substrate.