公开(公告)号：US09013017B2

公开(公告)日：2015-04-21

申请号：US13651526

申请日：2012-10-15

申请人： STMicroelectronics Asia Pacific Pte Ltd (Singapore)

发明人： Yonggang Jin ,  Laurent Herard ,  WeeChinJudy Lim

IPC分类号： H01L31/0232 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14687 ,  H01L31/0232 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of making image sensor devices may include forming a sensor layer including image sensor ICs in an encapsulation material, bonding a spacer layer to the sensor layer, the spacer layer having openings therein and aligned with the image sensor ICs, and bonding a lens layer to the spacer layer, the lens layer including lens in an encapsulation material and aligned with the openings and the image sensor ICs. The method may also include dicing the bonded-together sensor, spacer and lens layers to provide the image sensor devices. Helpfully, the method may use WLP to enhance production.

摘要翻译： 制作图像传感器装置的方法可以包括在封装材料中形成包括图像传感器IC的传感器层，将间隔层粘合到传感器层，间隔层在其中具有开口并与图像传感器IC对准，并且将透镜层 到间隔层，透镜层包括在封装材料中并与开口对准的透镜和图像传感器IC。 该方法还可以包括切割结合在一起的传感器，间隔物和透镜层以提供图像传感器装置。 有利的是，该方法可以使用WLP来增强生产。