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1.发明授权公开(公告)号：US09003644B2
公开(公告)日：2015-04-14
申请号：US13651562
申请日：2012-10-15
发明人： Hk Looi , Cheng-hai Cheh , HaiKin Toh
CPC分类号： B25J15/0616 , H05K13/0404 , H05K13/0408 , H05K13/0409 , Y10S901/40 , Y10T29/53178 , Y10T29/53191
摘要： A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.
摘要翻译： PNP装置可以包括机器人臂和由机器人手臂承载的PNP工具头。 PNP工具头可以包括构造成将粘合压力施加到电子设备的第一区域的主体，以及拾取尖端，当拾取尖端抵靠在主体上时，拾取尖端可相对于主体在延伸位置和缩回位置之间移动 电子设备的第二区域。 拾取尖端可以限定穿过其中的真空通道以将真空源耦合到电子设备的第二区域。
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2.发明授权公开(公告)号：US09229576B2
公开(公告)日：2016-01-05
申请号：US13648149
申请日：2012-10-09
IPC分类号： G06F3/041
CPC分类号： G06F3/0418
摘要： A method comprises during a frame period finding a first EFT noise influenced sensor of a touch screen panel, determining whether the first EFT noise influenced sensor is located at a last transmitting/driving line of the touch screen panel, designating the frame period as a noise influenced frame period using an absolute value threshold if the first EFT noise influenced sensor is not located at the last transmitting/driving line and designating the frame period as the noise influenced frame period using a percentage threshold if the first EFT noise influenced sensor is located at the last transmitting/driving line.
摘要翻译： 一种方法包括在帧周期期间找到触摸屏面板的第一EFT噪声影响传感器，确定所述第一EFT噪声影响传感器是否位于所述触摸屏面板的最后发射/驱动线上，将所述帧周期指定为噪声 如果第一EFT噪声影响传感器不位于最后的发射/驱动线路，并且如果第一EFT噪声影响传感器位于位置时，使用百分比阈值指定帧周期作为噪声影响帧周期，则使用绝对值阈值 最后一个发射/行驶线。
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公开(公告)号：US09059058B2
公开(公告)日：2015-06-16
申请号：US13656912
申请日：2012-10-22
发明人： Jerome Teysseyre , Yonggang Jin
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14625 , H01L24/97 , H01L27/14618 , H01L2924/12042 , H01L2924/00
摘要： An image sensor device may include a bottom interconnect layer, an image sensing IC above the bottom interconnect layer and coupled thereto, and an adhesive material on the image sensing IC. The image sensor device may include an IR filter layer above the lens layer, and an encapsulation material on the bottom interconnect layer and surrounding the image sensing IC, the lens layer, and the IR filter layer. The image sensor device may include a top contact layer above the encapsulation material and including a dielectric layer, and a contact thereon, the dielectric layer being flush with adjacent portions of the IR filter layer.
摘要翻译： 图像传感器装置可以包括底部互连层，在底部互连层上方并耦合到其上的图像感测IC以及图像感测IC上的粘合剂材料。 图像传感器装置可以包括在透镜层上方的IR滤光层，以及在底部互连层上的包围材料，并围绕图像感测IC，透镜层和IR滤光层。 图像传感器装置可以包括在封装材料上方的顶部接触层，并且包括介电层及其上的接触件，该介电层与IR滤光器层的相邻部分齐平。
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4.发明授权Method for making image sensors using wafer-level processing and associated devices 有权使用晶片级处理和相关设备制作图像传感器的方法公开(公告)号：US09013017B2
公开(公告)日：2015-04-21
申请号：US13651526
申请日：2012-10-15
发明人： Yonggang Jin , Laurent Herard , WeeChinJudy Lim
IPC分类号： H01L31/0232 , H01L31/0203
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L31/0232 , H01L2924/0002 , H01L2924/00
摘要： A method of making image sensor devices may include forming a sensor layer including image sensor ICs in an encapsulation material, bonding a spacer layer to the sensor layer, the spacer layer having openings therein and aligned with the image sensor ICs, and bonding a lens layer to the spacer layer, the lens layer including lens in an encapsulation material and aligned with the openings and the image sensor ICs. The method may also include dicing the bonded-together sensor, spacer and lens layers to provide the image sensor devices. Helpfully, the method may use WLP to enhance production.
摘要翻译： 制作图像传感器装置的方法可以包括在封装材料中形成包括图像传感器IC的传感器层，将间隔层粘合到传感器层，间隔层在其中具有开口并与图像传感器IC对准，并且将透镜层 到间隔层，透镜层包括在封装材料中并与开口对准的透镜和图像传感器IC。 该方法还可以包括切割结合在一起的传感器，间隔物和透镜层以提供图像传感器装置。 有利的是，该方法可以使用WLP来增强生产。
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