公开(公告)号：US11355851B2

公开(公告)日：2022-06-07

申请号：US16889240

申请日：2020-06-01

Applicant: STMicroelectronics SA ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Frederic Gianesello ,  Didier Campos

IPC: H01Q9/04 ,  H01Q5/357 ,  H01Q1/22 ,  H01Q21/28

Abstract: A first independent unit includes a support substrate with an integrated network of electrical connections. An electronic integrated circuit chip is mounted above a front face of the support substrate. A second independent unit includes a dielectric support. The second independent unit is stacked above the first independent unit on a side of the front face of the first independent unit. An electromagnetic antenna includes an exciter element and a resonator element. The exciter element provided at the support substrate. The resonator element is provided at the dielectric support.

公开(公告)号：US09870947B1

公开(公告)日：2018-01-16

申请号：US15632878

申请日：2017-06-26

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Didier Campos ,  Benoit Besancon ,  Perceval Coudrain ,  Jean-Philippe Colonna

IPC: H01L23/29 ,  H01L21/78 ,  H01L21/56 ,  H01L23/373 ,  H01L23/00 ,  H01L21/782 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/782 ,  H01L23/29 ,  H01L23/36 ,  H01L23/373 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.

公开(公告)号：US20180005889A1

公开(公告)日：2018-01-04

申请号：US15632878

申请日：2017-06-26

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Didier Campos ,  Benoit Besancon ,  Perceval Coudrain ,  Jean-Philippe Colonna

IPC: H01L21/78 ,  H01L23/373 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/29 ,  H01L21/782

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/782 ,  H01L23/29 ,  H01L23/36 ,  H01L23/373 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.

公开(公告)号：US11302672B2

公开(公告)日：2022-04-12

申请号：US16818792

申请日：2020-03-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier Campos

IPC: H01L21/00 ,  H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00

Abstract: The disclosure concerns an electronic device and methods of making an electronic device. The electronic device includes a circuit that is at least partially formed in an active region of a substrate. An electronic package is stacked on the substrate. A via extends through the circuit from the active region of the substrate to a surface of the substrate that is opposite the active region. At least one contacting element connects the via to the electronic package.

公开(公告)号：US11107742B2

公开(公告)日：2021-08-31

申请号：US16295132

申请日：2019-03-07

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier Campos

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498 ,  H01L23/373

Abstract: An electronic device includes a carrier wafer having a front side and a back side, with an electrical connection network configured to connect the front side to the back side. An electronic chip is mounted on the front side of the carrier wafer and electrically connected to front pads of the electrical connection network. A sheet of a thermally conductive graphite or a pyrolytic graphite is added to the back side of the carrier wafer. The sheet includes apertures which leave back pads of the electrical connection network uncovered.

公开(公告)号：US11488884B2

公开(公告)日：2022-11-01

申请号：US16889112

申请日：2020-06-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier Campos

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/522 ,  H01L23/36

Abstract: A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.