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公开(公告)号：US20200033286A1
公开(公告)日：2020-01-30
申请号：US16339933
申请日：2017-10-20
发明人： Shinya OTA , Masaaki YAMAUCHI , Jun SUGAWARA , Yasushi TAMURA , Kengo YOSHIDA , Takao INOUE , Hiroji SUGIMOTO
摘要： A method for producing an insulated electric wire includes a step of preparing a conductor having a linear shape; a step of forming an insulating coating so as to cover a surface on an outer peripheral side of the conductor to obtain an insulated electric wire that includes the conductor and the insulating coating covering the conductor; and a step of measuring a first electrostatic capacity between the insulated electric wire and a first electrode disposed outside in a radial direction of the insulated electric wire so as to face an outer peripheral surface of the insulated electric wire while transporting the insulated electric wire in a longitudinal direction of the conductor, and inspecting a formation state of the insulating coating, the formation state including a formation state of a defective portion in the insulating coating, on the basis of a change in the first electrostatic capacity.
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公开(公告)号：US20180033518A1
公开(公告)日：2018-02-01
申请号：US15550961
申请日：2016-10-25
发明人： Shinya OTA , Shuhei MAEDA , Hideaki SAITO , Jun SUGAWARA , Masaaki YAMAUCHI , Yasushi TAMURA , Kengo YOSHIDA , Yudai FURUYA , Yuji HATANAKA
摘要： An insulated electric wire includes a linear conductor and one or a plurality of insulating layers formed on an outer peripheral surface of the conductor. At least one of the one or plurality of insulating layers contains a plurality of pores, outer shells are disposed on peripheries of the pores, and the outer shells are derived from shells of hollow-forming particles having a core-shell structure. A varnish for forming an insulating layer contains a resin composition forming a matrix and hollow-forming particles having a core-shell structure and dispersed in the resin composition. In the varnish, cores of the hollow-forming particles contain a thermally decomposable resin as a main component, and shells of the hollow-forming particles contain a main component having a higher thermal decomposition temperature than the thermally decomposable resin.
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公开(公告)号：US20230017427A1
公开(公告)日：2023-01-19
申请号：US17620816
申请日：2019-06-20
发明人： Hideaki SAITO , Masaaki YAMAUCHI , Jun SUGAWARA , Yudai FURUYA , Kengo YOSHIDA , Yuji HATANAKA
摘要： The resin composition according to one aspect is a resin composition containing a polyamic acid and a solvent, wherein the polyamic acid has a repeating unit represented by the following general formula (1) in a molecular chain, and the molecular chain has a structure represented by the following general formula (2) at one end or both ends. The proportion of the structure represented by the following general formula (2) relative to 1 mol of the repeating unit represented by the following general formula (1) is 0.001 mol or more and 0.1 mol or less. In the following general formulas, R1 is a tetravalent organic group; R2 is a divalent organic group; and R3 is an organic group having 15 or less carbon atoms.
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公开(公告)号：US20190074106A1
公开(公告)日：2019-03-07
申请号：US15767109
申请日：2017-05-12
发明人： Shinya OTA , Masaaki YAMAUCHI , Jun SUGAWARA , Yasushi TAMURA , Kengo YOSHIDA
摘要： An insulated electric wire includes a linear conductor and one or more of insulating layers formed on an outer peripheral surface of the conductor. In the insulated electric wire, at least one of the one or more of insulating layers has a plurality of pores, outer shells are disposed on peripheries of the pores, and each of the outer shells has a plurality of projections on an outer surface thereof.
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公开(公告)号：US20240145116A1
公开(公告)日：2024-05-02
申请号：US17925671
申请日：2022-05-02
摘要： An insulated wire including: a linear conductor; and an insulating layer that covers an outer peripheral surface of the conductor, wherein the insulating layer contains, as residual solvents, a first solvent having a relative permittivity of 15 or more and a second solvent having a relative permittivity of less than 15, a first ratio that is a ratio of a content of the second solvent to a total content of the first solvent and the second solvent contained in the insulating layer is 50% by mass or more, and a second ratio that is a ratio of the content of the second solvent to the total content of the first solvent and the second solvent contained in the insulating layer after a heating treatment of heating the insulated wire at 350° C. for 1 minute is higher than the first ratio.
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公开(公告)号：US20240052199A1
公开(公告)日：2024-02-15
申请号：US18270884
申请日：2022-01-19
发明人： Hideaki SAITO , Takuya MURAKAMI , Masaaki YAMAUCHI
IPC分类号： C09D179/08 , H01B3/30 , H01B13/00 , H01B13/06 , C08G73/10 , C08K3/36 , C08K3/22 , C09D7/61 , C09D7/40 , C09D7/20
CPC分类号： C09D179/08 , H01B3/306 , H01B13/0016 , H01B13/06 , C08G73/1071 , C08G73/1042 , C08K3/36 , C08K3/22 , C09D7/61 , C09D7/69 , C09D7/68 , C09D7/67 , C09D7/20 , C08K2003/2227 , C08K2201/005 , C08K2201/011
摘要： An insulated wire comprising a conductor and an insulating layer covering the conductor, wherein: the insulating layer comprises a resin and a first filler; the resin comprises a polyimide; the first filler is present in the form of a primary particle or a secondary particle having a plurality of the primary particles aggregated; the primary particle is a silica or alumina particle; the secondary particle has a particle diameter of 0.03 μm or more and 5 μm or less; and the percentage of the total area of the secondary particles to the sum of the total area of the primary particles and the total area of the secondary particles in the cross section of the insulated wire is 50% or more.
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公开(公告)号：US20200152348A1
公开(公告)日：2020-05-14
申请号：US16604265
申请日：2018-04-26
发明人： Shinya OTA , Masaaki YAMAUCHI , Hideaki SAITO , Shuhei MAEDA , Yasushi TAMURA , Kengo YOSHIDA
IPC分类号： H01B3/30 , H01B3/00 , C09D179/08
摘要： An insulated electrical cable according to one aspect of the present invention is an insulated electrical cable including: a conductor; and an insulating layer that is laminated on an outer peripheral surface of the conductor and includes a polyimide as a main component, wherein the insulating layer includes a plurality of pores, and wherein a porosity of the insulating layer is greater than or equal to 25% by volume and less than or equal to 60% by volume.
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公开(公告)号：US20190215957A1
公开(公告)日：2019-07-11
申请号：US16336211
申请日：2018-06-20
摘要： A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
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