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公开(公告)号：US20230017427A1
公开(公告)日：2023-01-19
申请号：US17620816
申请日：2019-06-20
发明人： Hideaki SAITO , Masaaki YAMAUCHI , Jun SUGAWARA , Yudai FURUYA , Kengo YOSHIDA , Yuji HATANAKA
摘要： The resin composition according to one aspect is a resin composition containing a polyamic acid and a solvent, wherein the polyamic acid has a repeating unit represented by the following general formula (1) in a molecular chain, and the molecular chain has a structure represented by the following general formula (2) at one end or both ends. The proportion of the structure represented by the following general formula (2) relative to 1 mol of the repeating unit represented by the following general formula (1) is 0.001 mol or more and 0.1 mol or less. In the following general formulas, R1 is a tetravalent organic group; R2 is a divalent organic group; and R3 is an organic group having 15 or less carbon atoms.
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公开(公告)号：US20180033518A1
公开(公告)日：2018-02-01
申请号：US15550961
申请日：2016-10-25
发明人： Shinya OTA , Shuhei MAEDA , Hideaki SAITO , Jun SUGAWARA , Masaaki YAMAUCHI , Yasushi TAMURA , Kengo YOSHIDA , Yudai FURUYA , Yuji HATANAKA
摘要： An insulated electric wire includes a linear conductor and one or a plurality of insulating layers formed on an outer peripheral surface of the conductor. At least one of the one or plurality of insulating layers contains a plurality of pores, outer shells are disposed on peripheries of the pores, and the outer shells are derived from shells of hollow-forming particles having a core-shell structure. A varnish for forming an insulating layer contains a resin composition forming a matrix and hollow-forming particles having a core-shell structure and dispersed in the resin composition. In the varnish, cores of the hollow-forming particles contain a thermally decomposable resin as a main component, and shells of the hollow-forming particles contain a main component having a higher thermal decomposition temperature than the thermally decomposable resin.
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公开(公告)号：US20230250234A1
公开(公告)日：2023-08-10
申请号：US17918722
申请日：2021-06-11
发明人： Hideaki SAITO , Shigenori HOMMA , Jun SUGAWARA
CPC分类号： C08G75/23 , C08G59/245 , C08G59/4021 , C08G65/4056 , C08J9/42 , H01B3/30 , H01F5/06 , C08J2203/22 , C08J2363/02 , C08J2381/06
摘要： A resin composition includes a phenoxy resin as a principal component. The phenoxy resin has a weight-average molecular weight of 40,000 or more. The phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy and a second structural unit derived from a bisphenol epoxy other than the bisphenol S phenoxy. A content ratio of the first structural unit in the phenoxy resin is 20 mol% to 80 mol% relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.
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公开(公告)号：US20240052199A1
公开(公告)日：2024-02-15
申请号：US18270884
申请日：2022-01-19
发明人： Hideaki SAITO , Takuya MURAKAMI , Masaaki YAMAUCHI
IPC分类号： C09D179/08 , H01B3/30 , H01B13/00 , H01B13/06 , C08G73/10 , C08K3/36 , C08K3/22 , C09D7/61 , C09D7/40 , C09D7/20
CPC分类号： C09D179/08 , H01B3/306 , H01B13/0016 , H01B13/06 , C08G73/1071 , C08G73/1042 , C08K3/36 , C08K3/22 , C09D7/61 , C09D7/69 , C09D7/68 , C09D7/67 , C09D7/20 , C08K2003/2227 , C08K2201/005 , C08K2201/011
摘要： An insulated wire comprising a conductor and an insulating layer covering the conductor, wherein: the insulating layer comprises a resin and a first filler; the resin comprises a polyimide; the first filler is present in the form of a primary particle or a secondary particle having a plurality of the primary particles aggregated; the primary particle is a silica or alumina particle; the secondary particle has a particle diameter of 0.03 μm or more and 5 μm or less; and the percentage of the total area of the secondary particles to the sum of the total area of the primary particles and the total area of the secondary particles in the cross section of the insulated wire is 50% or more.
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公开(公告)号：US20200152348A1
公开(公告)日：2020-05-14
申请号：US16604265
申请日：2018-04-26
发明人： Shinya OTA , Masaaki YAMAUCHI , Hideaki SAITO , Shuhei MAEDA , Yasushi TAMURA , Kengo YOSHIDA
IPC分类号： H01B3/30 , H01B3/00 , C09D179/08
摘要： An insulated electrical cable according to one aspect of the present invention is an insulated electrical cable including: a conductor; and an insulating layer that is laminated on an outer peripheral surface of the conductor and includes a polyimide as a main component, wherein the insulating layer includes a plurality of pores, and wherein a porosity of the insulating layer is greater than or equal to 25% by volume and less than or equal to 60% by volume.
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