公开(公告)号：US20200045814A1

公开(公告)日：2020-02-06

申请号：US16341137

申请日：2017-10-05

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kohei OKAMOTO ,  Yoshihito YAMAGUCHI ,  Kousuke MIURA ,  Hiroshi UEDA ,  Atsushi KIMURA

IPC: H05K1/02 ,  H05K3/46

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 μm or more and 20 μm or less and an average height of 30 μm or more and 120 μm or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.

公开(公告)号：US20200022262A1

公开(公告)日：2020-01-16

申请号：US16495217

申请日：2017-12-22

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kohei OKAMOTO ,  Kousuke MIURA ,  Hiroshi UEDA ,  Shoichiro SAKAI ,  Maki IKEBE

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/24

Abstract: A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.

公开(公告)号：US20210392754A1

公开(公告)日：2021-12-16

申请号：US17446333

申请日：2021-08-30

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kohei OKAMOTO ,  Kousuke MIURA ,  Hiroshi UEDA ,  Shoichiro SAKAI ,  Maki IKEBE

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/24

Abstract: A printed wiring board according to as aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm.

公开(公告)号：US20190008037A1

公开(公告)日：2019-01-03

申请号：US15752359

申请日：2016-08-01

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kohei OKAMOTO ,  Kousuke MIURA ,  Hiroshi UEDA ,  Takashi KASUGA ,  Kazuhiro MIYATA

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/24

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.

公开(公告)号：US20180333739A1

公开(公告)日：2018-11-22

申请号：US15776813

申请日：2016-11-10

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kazuhiro MIYATA ,  Takashi KASUGA ,  Yoshio OKA ,  Yasuhiro OKUDA ,  Jinjoo PARK ,  Hiroshi UEDA ,  Kohei OKAMOTO

IPC: B05C5/02 ,  B05D1/26 ,  B05C11/10

CPC classification number: B05C5/0254 ,  B05C5/02 ,  B05C5/0208 ,  B05C11/10 ,  B05D1/26

Abstract: A coating device according to an aspect of the present invention includes a travel module that causes a strip-shaped sheet to travel in a longitudinal direction, a coating module that coats a surface of the strip-shaped sheet with ink while the strip-shaped sheet travels, and a supply module that supplies the ink to the coating module. The coating module includes a slot-type coating head that is disposed above the strip-shaped sheet so as to span the strip-shaped sheet in a width direction. The slot-type coating head includes an ink storage part that widens toward the strip-shaped sheet in cross-sectional view and an ink supply path that communicates with an upper part of the ink storage part.

公开(公告)号：US20190008035A1

公开(公告)日：2019-01-03

申请号：US15752383

申请日：2016-08-01

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kohei OKAMOTO ,  Kousuke MIURA ,  Hiroshi UEDA ,  Takashi KASUGA ,  Kazuhiro MIYATA

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/18 ,  H05K3/12 ,  H05K3/06

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.