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公开(公告)号：US20180054900A1
公开(公告)日：2018-02-22
申请号：US15557255
申请日：2016-03-10
发明人： Hiroshi UEDA , Kousuke MIURA , Yoshihito YAMAGUCHI , Yuka URABE
CPC分类号： H05K3/4673 , H01F17/0013 , H01F27/327 , H01F41/041 , H01F41/043 , H01F41/127 , H01F2017/0073 , H05K1/165 , H05K3/241 , H05K3/4626 , H05K3/4644 , H05K2203/1476 , H05K2203/1572
摘要： A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is ½ or more and 5 or less.
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公开(公告)号：US20200045814A1
公开(公告)日：2020-02-06
申请号：US16341137
申请日：2017-10-05
摘要： A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 μm or more and 20 μm or less and an average height of 30 μm or more and 120 μm or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.
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公开(公告)号：US20230212757A1
公开(公告)日：2023-07-06
申请号：US17998980
申请日：2021-11-16
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
发明人： Ryuta OHSUKA , Koji NITTA , Shoichiro SAKAI , Yoshihito YAMAGUCHI , Masaharu YASUDA , Akira TSUCHIKO , Koji KASUYA , Kenji NISHIE , Yu FUKUI
摘要： A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.-
公开(公告)号：US20230232540A1
公开(公告)日：2023-07-20
申请号：US17998966
申请日：2021-11-16
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
发明人： Shoichiro SAKAI , Ryuta OHSUKA , Koji NITTA , Yoshihito YAMAGUCHI , Masaharu YASUDA , Akira TSUCHIKO , Koji KASUYA , Kenji NISHIE , Yu FUKUI
CPC分类号： H05K3/103 , C22C19/05 , H05K1/0373 , H05K3/1258 , H05K2201/0212 , H05K2203/061 , H05K2203/176
摘要： In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) :
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.-
公开(公告)号：US20190082530A1
公开(公告)日：2019-03-14
申请号：US15765658
申请日：2016-10-03
发明人： Aya TAKASAKI , Yoshihito YAMAGUCHI
CPC分类号： H05K1/0253 , H05K1/0326 , H05K1/0346 , H05K3/28 , H05K3/4611 , H05K3/4676 , H05K2201/0141 , H05K2201/2009
摘要： A printed circuit board according to an embodiment of the present invention, which is configured to be disposed on an inner surface of an airtight case having an opening so as to hermetically cover the opening, includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening. An electronic component according to another embodiment of the present invention includes an airtight case having an opening and a printed circuit board disposed on an inner surface of the airtight case so as to hermetically cover the opening, wherein the printed circuit board includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening.
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