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公开(公告)号:US20210024352A1
公开(公告)日:2021-01-28
申请号:US17040106
申请日:2019-02-22
Applicant: SUMITOMO PRECISION PRODUCTS CO., LTD.
Inventor: Gen MATSUOKA , Mario KIUCHI
Abstract: Provided is a method including at least the thermal treatment step of thermally treating a SOI substrate having a first silicon layer at a first temperature that the diffusion flow rate of an interstitial silicon atom in a silicon single crystal is higher than the diffusion flow rate of an interstitial oxygen atom and the processing step of processing the SOI substrate after the thermal treatment step to obtain a displacement enlarging mechanism.
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公开(公告)号:US20160202473A1
公开(公告)日:2016-07-14
申请号:US15077105
申请日:2016-03-22
Applicant: SUMITOMO PRECISION PRODUCTS CO., LTD.
Inventor: Ryohei UCHINO , Gen MATSUOKA
CPC classification number: B81C1/00492 , B81B3/0086 , B81B2201/042 , B81B2203/0136 , B81C1/00404 , B81C1/00603 , B81C2201/0102 , B81C2201/0132 , B81C2201/0198 , G02B26/0841
Abstract: A mirror device includes a frame body, a mirror configured to tilt about a Y-axis with respect to the frame body, a fixed inner comb electrode including a plurality of electrode fingers arranged in the arrangement direction along the Y-axis and provided at the frame body, and a movable inner comb electrode including a plurality of electrode fingers arranged in the arrangement direction and provided at the mirror, the electrodes fingers of the fixed inner comb electrode and the movable inner comb electrode being alternately arranged. The mirror includes a mirror body and an extension extending from the mirror body. Some of the electrode fingers of the movable inner comb electrode are provided at the mirror body, and another electrode fingers of the movable inner comb electrode are provided at the extension.
Abstract translation: 反射镜装置包括框架体,配置成相对于框架体围绕Y轴倾斜的反射镜,固定的内梳状电极,包括沿着Y轴布置在排列方向上的多个电极指, 框体和可动内梳状电极,其包括沿着排列方向布置并设置在反射镜处的多个电极指,固定内梳电极和可移动内梳电极的电极指交替布置。 镜子包括镜体和从镜体延伸的延伸部分。 可动内梳电极的一些电极指设置在镜体上,可移动内梳电极的另一电极指在延伸部处设置。
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公开(公告)号:US20180287045A1
公开(公告)日:2018-10-04
申请号:US15758999
申请日:2016-08-31
Applicant: Sumitomo Precision Products Co., Ltd.
Inventor: Yusuke TABUCHI , Gen MATSUOKA , Takashi IKEDA
IPC: H01L41/047 , H01L41/053 , H01L41/23 , H01L41/29
Abstract: This piezoelectric element includes a lower electrode formed on a substrate, a piezoelectric layer formed on the lower electrode, and an upper electrode formed on the piezoelectric layer. The upper electrode includes a first upper electrode layer made of a metal oxide including an amorphous portion at least at a boundary with the piezoelectric layer and a second upper electrode layer formed on the first upper electrode layer.
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公开(公告)号:US20160200569A1
公开(公告)日:2016-07-14
申请号:US15077188
申请日:2016-03-22
Applicant: SUMITOMO PRECISION PRODUCTS CO., LTD.
Inventor: Yasuyuki HIRATA , Gen MATSUOKA
IPC: B81C1/00
CPC classification number: B81C1/00492 , B81B3/0086 , B81B2201/042 , B81B2203/0136 , B81C1/00404 , B81C1/00603 , B81C2201/0102 , B81C2201/0132 , B81C2201/0198 , G02B26/0841
Abstract: At the first etching step of etching an SOI substrate from a first silicon layer side, a portion of a first structure formed of the first silicon layer is formed as a pre-structure having a larger shape than a final shape. At the mask formation step of forming a final mask on a second silicon layer side of the SOI substrate, a first mask corresponding to the final shape of the first structure is formed in the pre-structure. At the second etching step of etching the SOI substrate from the second silicon layer side, the second silicon layer and the pre-structure are, using the first mask, etched to form the final shape of the first structure.
Abstract translation: 在从第一硅层侧蚀刻SOI衬底的第一蚀刻步骤中,由第一硅层形成的第一结构的一部分形成为具有比最终形状更大的形状的预结构。 在SOI衬底的第二硅层侧形成最终掩模的掩模形成步骤中,在预结构中形成对应于第一结构的最终形状的第一掩模。 在从第二硅层侧蚀刻SOI衬底的第二蚀刻步骤中,使用第一掩模蚀刻第二硅层和预制结构以形成第一结构的最终形状。
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