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公开(公告)号：US20230265558A1
公开(公告)日：2023-08-24
申请号：US17993147
申请日：2022-11-23
Applicant: Samsung Display Co., LTD.
Inventor： Choel Min JANG , Myung Soo HUH , Jung Gon KIM , Min Gyu PARK , Eun JUNG
IPC: C23C16/455
CPC classification number: C23C16/45504 , C23C16/45544
Abstract: An atomic layer deposition apparatus includes a substrate support which supports a substrate; a process module on the substrate support; a first gas pipe which supplies a first gas to the process module; a second gas pipe which supplies a second gas to the process module; and an exhaust part which discharges the first and second gases supplied to the process module. The process module includes: a first gas supply flow path portion connected to the first gas pipe; a second gas supply flow path portion under the first gas supply flow path portion and connected to the second gas pipe; and a gas exhaust flow path portion connected to the exhaust part. The gas exhaust flow path is spaced apart from the first and second gas supply flow path portions with the substrate therebetween, and the first and second gases pass through a process area in a laminar flow.
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公开(公告)号：US20230144827A1
公开(公告)日：2023-05-11
申请号：US17984500
申请日：2022-11-10
Applicant: Samsung Display Co., LTD.
Inventor： Choelmin JANG , Junggon KIM , Min-Gyu PARK , Heeyong LEE , Eun JUNG , Myungsoo HUH
CPC classification number: B05C11/1044 , B05C5/0287 , B05C11/1039 , B05C15/00 , B05B15/65 , B05B15/70 , B05B15/62
Abstract: A substrate processing apparatus may include a chamber having a working space, maintaining a vacuum state, and including an upper wall positioned on the working space, a nozzle assembly positioned in the working space, and including nozzles, and a lifting module including a frame positioned outside of the chamber, a lifting part that lifts the frame, and at least one shaft passing through the upper wall, connected to each of the frame and the nozzle assembly, and extending in a direction of gravity.
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