Electrodes for light emitting element of a display device

    公开(公告)号:US11967585B2

    公开(公告)日:2024-04-23

    申请号:US17088427

    申请日:2020-11-03

    Abstract: A display device includes a substrate, a first electrode, and a second electrode spaced from each other on the substrate, a first insulating layer on the first electrode, a first light emitting element between the first electrode and the second electrode, a second light emitting element on the first insulating layer and spaced from the first light emitting element, and a second insulating layer on the first insulating layer and covering at least a portion of the second light emitting element, wherein the first insulating layer includes at least one first opening penetrating the first insulating layer to expose a portion of the first electrode, the second insulating layer includes at least one second opening penetrating the second insulating layer to expose a portion of the first insulating layer, the at least one first opening and the at least one second opening do not overlap each other.

    METHOD OF MANUFACTURING DISPLAY DEVICE USING BOTTOM SURFACE EXPOSURE

    公开(公告)号:US20180095362A1

    公开(公告)日:2018-04-05

    申请号:US15831547

    申请日:2017-12-05

    Abstract: A method for manufacturing a display device includes forming a plurality of light blocking patterns on a first surface of a transparent substrate, wherein a first light blocking pattern of the plurality of light blocking patterns has a different line width than a second light blocking pattern of the plurality of light blocking patterns. An insulating layer is formed on the first surface of the transparent substrate and the light blocking patterns. A conductive layer is formed on the insulating layer. A photo-resist layer is formed on the conductive layer. The photo-resist layer is exposed with ultraviolet rays through a second surface of the transparent substrate, wherein the first and second surfaces of the transparent substrate are opposite to each other. The photo-resist layer is developed. The conductive layer is etched using the photo-resist layer as a mask. The photo-resist layer is removed.

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