公开(公告)号：US09688094B2

公开(公告)日：2017-06-27

申请号：US14986973

申请日：2016-01-04

Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

Inventor： Il Young Jeong ,  Tae Yong Kim ,  Cheol Lae Roh ,  Je Kil Ryu ,  Jeong Hun Woo ,  Gyoo Wan Han ,  Ki Su Han ,  Tae Hyoung Cho ,  Jong Nam Moon

IPC: B44C1/22 ,  C03B33/09 ,  C03B33/02 ,  C03B33/07 ,  C03B33/08 ,  H01L21/78 ,  B23K26/06 ,  B23K26/38

CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

公开(公告)号：US12109806B2

公开(公告)日：2024-10-08

申请号：US17904370

申请日：2020-06-02

Applicant: Samsung Display Co., LTD.

Inventor： Byung Chul Lee ,  Heung Cheol Jeong ,  Myung Soo Huh ,  Cheol Lae Roh ,  Do Hun Lee

IPC: B41J2/045 ,  G01N15/1434 ,  G01N15/14

CPC classification number: B41J2/0451 ,  B41J2/04586 ,  G01N15/1434 ,  G01N2015/1486

Abstract: Provided are an inkjet printing apparatus and a method for inspecting an inkjet head using same. The inkjet printing apparatus comprises: an inspection stage unit on which an inspection substrate is seated; an inkjet head unit including at least one inkjet head that ejects ink containing dipoles and a solvent in which the dipoles disperse, on the inspection stage unit; and a particle count inspection unit that is located so as to be spaced apart from the inkjet head unit in one direction. The particle count inspection unit comprises: a first heat treatment unit that is located on the top portion of the inspection stage unit; and a first sensing unit that is located on the bottom portion of the inspection stage unit and measures the number of dipoles sprayed onto the inspection substrate.

公开(公告)号：US11362162B2

公开(公告)日：2022-06-14

申请号：US16132031

申请日：2018-09-14

Applicant: Samsung Display Co., Ltd.

Inventor： Myung Soo Huh ,  Dong Kyun Ko ,  Sung Chui Kim ,  Woo Jin Kim ,  Cheol Lae Roh ,  Keun Hee Park

IPC: H01L27/32 ,  H01L21/02 ,  H01L49/02 ,  H01L51/52 ,  H01L27/12

Abstract: A method of manufacturing a metal oxide film includes injecting a reaction gas and metal precursors into a chamber, forming a first metal precursor film on a substrate in a plasma OFF state, forming a first sub-metal oxide film by oxidizing the first metal precursor film in a plasma ON state, and forming a second metal precursor film on the first sub-metal oxide film in the plasma OFF state, where the metal oxide film has an amorphous phase, a thickness of about 20 nanometer (nm) to about 130 nm, and a dielectric constant of about 10 to about 50.

公开(公告)号：US09299613B2

公开(公告)日：2016-03-29

申请号：US14324825

申请日：2014-07-07

Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

Inventor： Il Young Jeong ,  Tae Yong Kim ,  Cheol Lae Roh ,  Je Kil Ryu ,  Jeong Hun Woo ,  Gyoo Wan Han ,  Ki Su Han ,  Tae Hyoung Cho ,  Jong Nam Moon

IPC: H01L21/78 ,  C03B33/09 ,  C03B33/02 ,  C03B33/07 ,  C03B33/08 ,  B23K26/06 ,  B23K26/38

CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract translation: 一种用于切割衬底的方法包括：作为第一激光辐射处理的一部分，朝向衬底的表面辐射激光，以在衬底中形成第一凹槽。 朝向表面辐射激光包括依次将激光朝向第一外部点（FOP），第二外部点（SOP），第一中间点（FIP），第二中间点（SIP）和第一外部点 切割点（FCP），每个点彼此间隔开一个或多个距离。 FCP对应于基板的切割线。 FOP和SOP分别设置在FCP的侧面。 FIP位于FCP和FOP之间。 SIP位于FCP和SOP之间。 相同种类和强度的激光辐射到每个点。