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公开(公告)号：US12048232B2
公开(公告)日：2024-07-23
申请号：US18135693
申请日：2023-04-17
Applicant: Samsung Display Co., Ltd.
Inventor： Jong Hee Lim , Jae Il Kim , Jong Hyup Kim , Kang Hyuk Lee , Jin Pyung Lee , Il Young Jeong
IPC: H10K71/00
CPC classification number: H10K71/00
Abstract: An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.
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公开(公告)号：US09299613B2
公开(公告)日：2016-03-29
申请号：US14324825
申请日：2014-07-07
Applicant: Samsung Display Co., Ltd. , Philoptics Co., Ltd.
Inventor： Il Young Jeong , Tae Yong Kim , Cheol Lae Roh , Je Kil Ryu , Jeong Hun Woo , Gyoo Wan Han , Ki Su Han , Tae Hyoung Cho , Jong Nam Moon
CPC classification number: B44C1/228 , B23K26/0626 , B23K26/38 , C03B33/0222 , C03B33/07 , C03B33/082 , C03B33/091 , H01L21/78
Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
Abstract translation: 一种用于切割衬底的方法包括：作为第一激光辐射处理的一部分，朝向衬底的表面辐射激光，以在衬底中形成第一凹槽。 朝向表面辐射激光包括依次将激光朝向第一外部点（FOP），第二外部点（SOP），第一中间点（FIP），第二中间点（SIP）和第一外部点 切割点（FCP），每个点彼此间隔开一个或多个距离。 FCP对应于基板的切割线。 FOP和SOP分别设置在FCP的侧面。 FIP位于FCP和FOP之间。 SIP位于FCP和SOP之间。 相同种类和强度的激光辐射到每个点。
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公开(公告)号：US11665952B2
公开(公告)日：2023-05-30
申请号：US17222877
申请日：2021-04-05
Applicant: Samsung Display Co., Ltd.
Inventor： Jong Hee Lim , Jae Il Kim , Jong Hyup Kim , Kang Hyuk Lee , Jin Pyung Lee , Il Young Jeong
CPC classification number: H01L51/56
Abstract: An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.
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Patent Agency Ranking
公开(公告)号：US11000919B2
公开(公告)日：2021-05-11
申请号：US15798849
申请日：2017-10-31
Applicant: Samsung Display Co., Ltd.
Inventor： Il Young Jeong , Gyoo Wan Han
IPC: B23K26/067 , B23K26/06
Abstract: A laser processing apparatus includes: a scanner configured to adjust a path of at least one of a first laser beam and a second laser beam; and a lens unit configured to condense the first laser beam and the second laser beam received from the scanner. The scanner may include a first reflection member for providing the first laser beam to the lens unit and a second reflection member for providing the second laser beam to the first reflection member.
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公开(公告)号：US12153237B2
公开(公告)日：2024-11-26
申请号：US17190092
申请日：2021-03-02
Applicant: Samsung Display Co., Ltd.
Inventor： Geun Woo Yug , Jung Hwa You , Il Young Jeong , Soo Bum Park , Myeong Seok Jeong
IPC: G02B5/30 , B23K26/351 , B23K26/362 , B23K26/40 , B23K26/50 , G02F1/1333 , G02F1/1335
Abstract: A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.
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公开(公告)号：US20210336237A1
公开(公告)日：2021-10-28
申请号：US17222877
申请日：2021-04-05
Applicant: Samsung Display Co., Ltd.
Inventor： Jong Hee Lim , Jae Il Kim , Jong Hyup Kim , Kang Hyuk Lee , Jin Pyung Lee , Il Young Jeong
IPC: H01L51/56
Abstract: An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.
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公开(公告)号：US10962697B2
公开(公告)日：2021-03-30
申请号：US15715752
申请日：2017-09-26
Applicant: Samsung Display Co., Ltd.
Inventor： Geun Woo Yug , Jung Hwa You , Il Young Jeong , Soo Bum Park , Myeong Seok Jeong
IPC: G02B5/30 , B23K26/351 , B23K26/40 , G02F1/1335 , G02F1/1333
Abstract: A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.
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公开(公告)号：US09688094B2
公开(公告)日：2017-06-27
申请号：US14986973
申请日：2016-01-04
Applicant: Samsung Display Co., Ltd. , Philoptics Co., Ltd.
Inventor： Il Young Jeong , Tae Yong Kim , Cheol Lae Roh , Je Kil Ryu , Jeong Hun Woo , Gyoo Wan Han , Ki Su Han , Tae Hyoung Cho , Jong Nam Moon
CPC classification number: B44C1/228 , B23K26/0626 , B23K26/38 , C03B33/0222 , C03B33/07 , C03B33/082 , C03B33/091 , H01L21/78
Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
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