公开(公告)号：US11556002B2

公开(公告)日：2023-01-17

申请号：US16802011

申请日：2020-02-26

Applicant: Samsung Display Co., Ltd.

Inventor： Jihwan Kim ,  Jongjun Baek ,  Byungsoo So ,  Hiroshi Okumura

IPC: G02B26/12 ,  G02F1/07 ,  H01L21/67 ,  H01L21/02 ,  B23K26/354 ,  B23K26/064 ,  B23K26/082

Abstract: Provided are a laser annealing apparatus and a method of manufacturing a substrate having a poly-Si layer using the laser annealing apparatus. The laser annealing apparatus includes a laser beam source that emits a linearly polarized laser beam, a polygon mirror that rotates around a rotation axis and reflects the laser beam emitted from the laser beam source, a first Kerr cell disposed on a laser beam path between the laser beam source and the polygon mirror, and a first optical element that directs the laser beam reflected by the polygon mirror toward an amorphous Si layer where the laser beam is irradiated upon the amorphous Si layer.

公开(公告)号：US20210013281A1

公开(公告)日：2021-01-14

申请号：US16877735

申请日：2020-05-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dongsung Lee ,  Jihwan Kim ,  Jongoh Seo ,  Byungsoo So ,  Dongmin Lee ,  Yeonhee Jeon ,  Jonghoon Choi ,  Byungkyu Son ,  Seunghyun Jang

IPC: H01L27/32 ,  H01L51/56 ,  H01L27/12 ,  H01L29/786 ,  H01L29/66 ,  H01L21/02

Abstract: A method of manufacturing a thin film transistor includes: removing an oxide film on a surface of an amorphous silicon layer by performing a surface cleaning; and forming an active layer by performing a heat treatment on the amorphous silicon layer, where the amorphous silicon layer is changed into crystalline silicon by the heat treatment.

公开(公告)号：US11329117B2

公开(公告)日：2022-05-10

申请号：US16877735

申请日：2020-05-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dongsung Lee ,  Jihwan Kim ,  Jongoh Seo ,  Byungsoo So ,  Dongmin Lee ,  Yeonhee Jeon ,  Jonghoon Choi ,  Byungkyu Son ,  Seunghyun Jang

IPC: H01L27/32 ,  H01L51/56 ,  H01L27/12 ,  H01L29/786 ,  H01L21/02 ,  H01L29/66

Abstract: A method of manufacturing a thin film transistor includes: removing an oxide film on a surface of an amorphous silicon layer by performing a surface cleaning; and forming an active layer by performing a heat treatment on the amorphous silicon layer, where the amorphous silicon layer is changed into crystalline silicon by the heat treatment.