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    WINDOW TRANSFER METHOD AND WINDOW MANUFACTURING METHOD USING THE SAME
    2.
    发明申请
    WINDOW TRANSFER METHOD AND WINDOW MANUFACTURING METHOD USING THE SAME 有权

    公开(公告)号：US20220371315A1

    公开(公告)日：2022-11-24

    申请号：US17712025

    申请日：2022-04-01

    Applicant: Samsung Display Co., Ltd.

    Inventor： SEUNGJUN LEE ,  HANGGYUN PARK ,  LEEGU HAN

    IPC: B32B38/18 ,  B32B37/10 ,  B32B37/12

    Abstract: A window transfer method and a window manufacturing method using a window transfer method are provided. A window transfer method includes preparing a stage, transferring the stage over a loading part on which a window layer is loaded, transferring the stage to be adjacent to an upper surface of the window layer and to allow a plurality of protrusion parts attached to side surfaces of the stage to press a slip sheet layer arranged under the window layer and exposed outside the window layer, and suctioning the window layer to a lower surface of the stage to separate the window layer from the slip sheet layer.

    GLASS STACK STRUCTURE FOR FORMING A FLEXBILE GLASS AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    GLASS STACK STRUCTURE FOR FORMING A FLEXBILE GLASS AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220134707A1

    公开(公告)日：2022-05-05

    申请号：US17387183

    申请日：2021-07-28

    Applicant: Samsung Display Co., Ltd.

    Inventor： SEUNGJUN LEE ,  SUNG-SHIN KWAK ,  SUNKWAN KIM ,  DAEHO YANG ,  JUN HWAN CHOI

    IPC: B32B7/14 ,  B32B3/18 ,  B32B17/10 ,  B32B37/12

    Abstract: A glass stack structure includes: a carrier plate having a width in a first direction and a length in a second direction; a stack glass on the carrier plate and including mother glasses sequentially stacked therein; adhesive lines including a high viscous material and arranged at peripheral portions of the carrier plate and the mother glasses to adhere the carrier plate to the mother glasses, and the adhesive lines includes wave lines extending in the second direction and spaced apart from each other in the first direction and linear lines extending in the first direction and spaced apart from each other in the second direction; and an adhesive layer including a low viscous material and covering a cell area of the carrier plate and the mother glasses to adhere the carrier plate to the mother glasses, where the cell area is defined by the wave lines and the linear lines.

    WINDOW MANUFACTURING SYSTEM AND WINDOW MANUFACURING METHOD USING THE SAME
    5.
    发明申请
    WINDOW MANUFACTURING SYSTEM AND WINDOW MANUFACURING METHOD USING THE SAME 有权

    公开(公告)号：US20220297416A1

    公开(公告)日：2022-09-22

    申请号：US17837549

    申请日：2022-06-10

    Applicant: Samsung Display Co., Ltd.

    Inventor： SEUNGJUN LEE

    IPC: B32B37/12 ,  B32B7/12 ,  B32B17/06 ,  B32B41/00

    Abstract: A window manufacturing system includes a first processing unit in which a process of providing a dummy substrate on a stage is performed, a second processing unit in which a process of providing a dummy adhesive layer on the dummy substrate is performed, a third processing unit in which a process of providing a window layer on the dummy adhesive layer is performed, and a fourth processing unit in which a process of providing a protective cover on the window layer is performed. The fourth processing unit includes a pressurization unit which presses the protective cover to the window layer.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20230056897A1

    公开(公告)日：2023-02-23

    申请号：US17841904

    申请日：2022-06-16

    Applicant: Samsung Display Co., Ltd.

    Inventor： MYEONGHO KIM ,  JAYBUM KIM ,  KYOUNG SEOK SON ,  SEUNGJUN LEE ,  SEUNGHUN LEE ,  JUN HYUNG LIM

    IPC: H01L27/12

    Abstract: A display device includes a first semiconductor layer, a first conductive layer disposed on the first semiconductor layer and including a first capacitor electrode at least partially overlapping the first semiconductor layer in a plan view to constitute a first transistor, a second capacitor electrode disposed on the first conductive layer and overlapping the first capacitor electrode in a plan view to constitute a first capacitor, a second semiconductor layer disposed on the second capacitor electrode and including a third capacitor electrode overlapping the second capacitor electrode in a plan view to constitute a second capacitor, a second conductive layer disposed on the second semiconductor layer and at least partially overlapping the second semiconductor layer, and a third conductive layer disposed over the second conductive layer to implement a high-resolution image by overlapping the first capacitor electrode, the second capacitor electrode, and the third capacitor electrode.

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