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    DISTANCE DETECTION APPARATUS AND CAMERA MODULE INCLUDING THE SAME
    2.
    发明申请
    DISTANCE DETECTION APPARATUS AND CAMERA MODULE INCLUDING THE SAME 审中-公开
    距离检测装置和摄像机模块，包括它们

    公开(公告)号：US20160377426A1

    公开(公告)日：2016-12-29

    申请号：US14994652

    申请日：2016-01-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun KIM

    IPC: G01C3/08 ,  H04N5/378 ,  H04N9/04 ,  H04N5/04 ,  H04N5/235 ,  H04N5/225 ,  H04N5/376

    CPC classification number: G01C3/08 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/2353 ,  H04N5/3765 ,  H04N5/378 ,  H04N9/04

    Abstract: A distance detection apparatus includes an image sensor including a first image sensor pixel array and a second image sensor pixel array each including pixels, and a synchronization unit synchronizing operations of the first image sensor pixel array and the second image sensor pixel array. In an example, the distance detection apparatus and the camera module precisely align optical axes of the two cameras without a manufacturing process error and accurately calculate distance information while reducing processing requirements.

    Abstract translation: 距离检测装置包括：图像传感器，包括第一图像传感器像素阵列和每个包括像素的第二图像传感器像素阵列;以及同步单元，同步第一图像传感器像素阵列和第二图像传感器像素阵列的操作。 在一个示例中，距离检测装置和相机模块精确地对准两个相机的光轴而没有制造过程错误，并且在减少处理要求的同时精确地计算距离信息。

    CAMERA MODULE
    3.
    发明公开
    CAMERA MODULE 审中-公开

    公开(公告)号：US20240155216A1

    公开(公告)日：2024-05-09

    申请号：US18196883

    申请日：2023-05-12

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Hae Seung HYUN ,  Hyun KIM

    IPC: H04N23/57 ,  G03B5/00 ,  G03B13/36 ,  G03B17/12 ,  G03B17/17 ,  G03B30/00

    CPC classification number: H04N23/57 ,  G03B5/00 ,  G03B13/36 ,  G03B17/12 ,  G03B17/17 ,  G03B30/00 ,  G03B2205/0046 ,  G03B2205/0069

    Abstract: A camera module includes a plurality of lens modules having mutually different optical axes, a plurality of reflective members configured to change a path of light passing through at least one of the plurality of lens modules, and a housing having an internal space in which at least one of the plurality of lens modules is disposed. The plurality of lens modules include a first lens module including at least one lens disposed along a first optical axis, a second lens module including at least one lens disposed along a second optical axis, and a third lens module including at least one lens disposed along a third optical axis. The plurality of reflective members include a first reflective member opposing both the first lens module and the second lens module, and a second reflective member opposing both the second lens module and the third lens module.

    CAMERA MODULE
    8.
    发明公开
    CAMERA MODULE 审中-公开

    公开(公告)号：US20240163539A1

    公开(公告)日：2024-05-16

    申请号：US18188535

    申请日：2023-03-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun KIM

    IPC: H04N23/55 ,  G03B17/17

    CPC classification number: H04N23/55 ,  G03B17/17

    Abstract: A camera module includes a first prism having refractive power, a first lens module disposed adjacently to an object-side surface of the first prism, and a first driving member driving the first lens module in a direction intersecting an optical axis.

    ELECTRONIC DEVICE WITH HEAT-RADIANT STRUCTURE
    9.
    发明申请
    ELECTRONIC DEVICE WITH HEAT-RADIANT STRUCTURE 审中-公开

    公开(公告)号：US20200319307A1

    公开(公告)日：2020-10-08

    申请号：US16840037

    申请日：2020-04-03

    Applicant: Samsung Electronics Co., Ltd. ,  Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jaeyoung HUH ,  Kyungwan PARK ,  Jungho BAE ,  Boram KIM ,  Youngjin KIM ,  Hyun KIM ,  Byeonghoon PARK ,  Yoonsun PARK ,  Woontahk SUNG ,  Kyungwoo LEE ,  Kihoon JANG ,  Younho CHOI

    IPC: G01S7/481 ,  G03B17/55 ,  H01S5/024 ,  H01S5/022 ,  H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K7/20 ,  G01S17/10

    Abstract: An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate facing a first direction and a back plate facing a second direction opposite to the first direction, an image sensor to receive light through a first region of the back plate, the image sensor disposed inside the housing, a laser emitter to emit light through a second region of the back plate, adjacent to the first region, the laser emitter disposed inside the housing, adjacent to the image sensor, a laser driver disposed between the laser emitter and the front plate, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure disposed between the laser emitter and the laser driver, a first heat transfer member including a first portion disposed between the first metal structure and the driver, a second portion extended from the first portion along an outer face of the housing structure, and a third portion extended from the second portion to a space between the driver and the front plate, while in contact with the first metal structure, a second heat transfer member extended from the third portion of the first heat transfer member, and a first Thermal Interface Material (TIM) disposed between the second heat transfer member and the front plate, the first TIM being in contact with the second heat transfer member.

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