公开(公告)号：US20170223832A1

公开(公告)日：2017-08-03

申请号：US15248512

申请日：2016-08-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hae Suk CHUNG ,  Kyung Pyo HONG ,  Mi Suk LEE ,  Min Hyang KIM ,  Kyeong Jun KIM ,  Tae Ho SONG ,  Seung Hyun RA

IPC: H05K1/18 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01G4/005 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.