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公开(公告)号：US11025218B2
公开(公告)日：2021-06-01
申请号：US16670770
申请日：2019-10-31
发明人： Kang Ta Jo , Seong Jong Cheon
摘要： A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.
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公开(公告)号：US10020107B1
公开(公告)日：2018-07-10
申请号：US15787228
申请日：2017-10-18
发明人： Jeong Hae Kim , Seong Jong Cheon , Sung Jae Yoon , Se Jong Kim
摘要： A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.
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公开(公告)号：US11183765B2
公开(公告)日：2021-11-23
申请号：US16891265
申请日：2020-06-03
发明人： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
摘要： A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US10784839B2
公开(公告)日：2020-09-22
申请号：US16180495
申请日：2018-11-05
发明人： Jeong Hae Kim , Seong Jong Cheon , Hyung Jin Lee
摘要： A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.
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公开(公告)号：US10135421B2
公开(公告)日：2018-11-20
申请号：US15481013
申请日：2017-04-06
发明人： Seong Jong Cheon
摘要： A bulk-acoustic wave filter device includes: a first substrate; a first filter disposed on the first substrate, within a cavity of the bulk-acoustic wave filter device; a second substrate coupled to the first substrate; a second filter disposed on the second substrate, within the cavity and facing the first filter; a first inductor layer disposed on the first substrate and around the first filter; a second inductor layer disposed on the second substrate and around the second filter, and bonded to the first inductor layer; and a sealing member sealing the cavity, together with the first and second inductor layers.
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公开(公告)号：US11496107B2
公开(公告)日：2022-11-08
申请号：US17246993
申请日：2021-05-03
发明人： Kang Ta Jo , Seong Jong Cheon
摘要： A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.
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公开(公告)号：US11133592B2
公开(公告)日：2021-09-28
申请号：US16891200
申请日：2020-06-03
发明人： Ho Kyung Kang , Seong Jong Cheon , Hak Gu Kim , Young Sik Hur , Jin Seon Park , Yong Duk Lee
摘要： A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
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公开(公告)号：US11101840B1
公开(公告)日：2021-08-24
申请号：US16994955
申请日：2020-08-17
发明人： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
IPC分类号： H01L25/16 , H01L21/56 , H01L23/495 , H01L23/488 , H05K1/18 , H04B1/40 , H01Q9/04 , H01Q1/22 , H01L25/065 , H01L23/538 , H01L23/66
摘要： A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US10749493B2
公开(公告)日：2020-08-18
申请号：US16276995
申请日：2019-02-15
发明人： Hyung Jin Lee , Seong Jong Cheon , Jeong Hae Kim
IPC分类号： H03H7/01
摘要： A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.
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公开(公告)号：US11539138B2
公开(公告)日：2022-12-27
申请号：US17505743
申请日：2021-10-20
发明人： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
摘要： A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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