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公开(公告)号：US20220104347A1
公开(公告)日：2022-03-31
申请号：US17239169
申请日：2021-04-23
发明人： Je Sang Park , Sang Ho Jeong , Yong Duk Lee
IPC分类号： H05K1/02 , H05K1/11 , H05K3/46 , H05K1/18 , H01L23/538 , H01L25/18 , H01L25/065
摘要： A printed circuit board includes a first insulating layer; a first wiring layer having at least a portion buried in one surface side of the first insulating layer and having at least a portion of one surface exposed from the one surface of the first insulating layer; a metal post disposed on the exposed one surface of at least the portion of the first wiring layer; and a second wiring layer disposed on the other surface of the first insulating layer. A width of a first surface, connected to the exposed one surface of at least a portion of the first wiring layer, of the metal post, is greater than a width of a second surface of the metal post opposing the first surface.
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公开(公告)号：US11251133B2
公开(公告)日：2022-02-15
申请号：US16817807
申请日：2020-03-13
发明人： Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Ki Ho Na , Je Sang Park , Yong Duk Lee , Jin Won Lee
IPC分类号： H01L23/538 , H01L23/64 , H01L23/66 , H01L25/065 , H01L25/16 , H05K1/03 , H05K3/46
摘要： A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.
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公开(公告)号：US11183462B2
公开(公告)日：2021-11-23
申请号：US16809925
申请日：2020-03-05
发明人： Mi Sun Hwang , Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Jun Hyeong Jang , Ki Ho Na , Je Sang Park , Yong Duk Lee , Yoo Rim Cha , Yeo Il Park
IPC分类号： H01L23/538 , H01L23/00
摘要： A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.
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公开(公告)号：US11658417B2
公开(公告)日：2023-05-23
申请号：US17208139
申请日：2021-03-22
发明人： Yang Je Lee , Chang Gun Oh , Hyun Kyung Park , Je Sang Park , Sang Ho Jeong , Yong Duk Lee
CPC分类号： H01Q9/0407 , H01Q1/22 , H05K1/113 , H05K2201/10098
摘要： An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.
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公开(公告)号：US11183765B2
公开(公告)日：2021-11-23
申请号：US16891265
申请日：2020-06-03
发明人： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
摘要： A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US11640952B2
公开(公告)日：2023-05-02
申请号：US16804421
申请日：2020-02-28
发明人： Mi Sun Hwang , Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Jun Hyeong Jang , Ki Ho Na , Je Sang Park , Yong Duk Lee , Yoo Rim Cha , Yeo Il Park
IPC分类号： H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56 , H01L23/498
摘要： An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.
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公开(公告)号：US11133592B2
公开(公告)日：2021-09-28
申请号：US16891200
申请日：2020-06-03
发明人： Ho Kyung Kang , Seong Jong Cheon , Hak Gu Kim , Young Sik Hur , Jin Seon Park , Yong Duk Lee
摘要： A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
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公开(公告)号：US11101840B1
公开(公告)日：2021-08-24
申请号：US16994955
申请日：2020-08-17
发明人： Hak Gu Kim , Ho Kyung Kang , Seong Jong Cheon , Young Sik Hur , Jin Seon Park , Yong Duk Lee
IPC分类号： H01L25/16 , H01L21/56 , H01L23/495 , H01L23/488 , H05K1/18 , H04B1/40 , H01Q9/04 , H01Q1/22 , H01L25/065 , H01L23/538 , H01L23/66
摘要： A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20210193609A1
公开(公告)日：2021-06-24
申请号：US16804421
申请日：2020-02-28
发明人： Mi Sun Hwang , Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Jun Hyeong Jang , Ki Ho Na , Je Sang Park , Yong Duk Lee , Yoo Rim Cha , Yeo Il Park
IPC分类号： H01L23/00 , H01L21/48 , H01L23/538 , H01L21/56 , H01L23/498
摘要： An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.
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公开(公告)号：US20210193563A1
公开(公告)日：2021-06-24
申请号：US16807473
申请日：2020-03-03
发明人： Dae Jung Byun , Yong Duk Lee , Chang Hwa Park , Ki Ho Na , Je Sang Park , Jin Won Lee
IPC分类号： H01L23/498 , H01L23/13 , H01L23/00 , H01L21/48 , H01L21/683
摘要： A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.
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