公开(公告)号：US20170055345A1

公开(公告)日：2017-02-23

申请号：US15084864

申请日：2016-03-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Han KIM ,  Han KIM ,  Mi-Sun HWANG ,  Sang-Yul HA ,  Seok-Hwan AHN ,  Kyung-Ho LEE

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K3/0017 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/2009

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘基板，设置在绝缘基板上的电路，在绝缘基板上空间分离的一对第一加强件，平行于绝缘基板的表面延伸的第一加强件，以及第二加强件， 一对第一加强。