公开(公告)号：US20170055345A1

公开(公告)日：2017-02-23

申请号：US15084864

申请日：2016-03-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Han KIM ,  Han KIM ,  Mi-Sun HWANG ,  Sang-Yul HA ,  Seok-Hwan AHN ,  Kyung-Ho LEE

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K3/0017 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/2009

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘基板，设置在绝缘基板上的电路，在绝缘基板上空间分离的一对第一加强件，平行于绝缘基板的表面延伸的第一加强件，以及第二加强件， 一对第一加强。

公开(公告)号：US20200022258A1

公开(公告)日：2020-01-16

申请号：US16390310

申请日：2019-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung-Jun LIM ,  Seong-Hwan PARK ,  Kyung-Ho LEE ,  Kyung-Moon JUNG ,  Chul-Kyu KIM

IPC: H05K1/02

Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.