公开(公告)号：US20160381796A1

公开(公告)日：2016-12-29

申请号：US15096993

申请日：2016-04-12

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Sung-Uk LEE ,  Il-Jong SEO ,  Jae-Hoon CHOI ,  Yong-Ho BAEK

IPC分类号： H05K1/11 ,  H05K3/06

CPC分类号： H05K1/115 ,  H05K3/067 ,  H05K3/4647 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/09854 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384

摘要： A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

摘要翻译： 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层，嵌入绝缘层中的电路层，设置在绝缘层的一个表面上的阻焊层，阻焊层具有通孔形状的空腔，以暴露部分 电路层，以及嵌入到阻焊层中并经由阻焊层的开口暴露于外部的金属柱，金属柱包括第一后​​金属层，后阻挡层和第二柱 金属层。