公开(公告)号：US20160143142A1

公开(公告)日：2016-05-19

申请号：US14943866

申请日：2015-11-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung-Hyun CHO ,  Yong-Ho BAEK ,  Young-Gwan KO ,  Jae-Hoon CHOI ,  Jung-Hyun PARK

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/007 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/92144 ,  H05K1/187 ,  H05K3/42 ,  H05K2201/10015

Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.

Abstract translation: 元件嵌入式印刷电路板包括：基板，包括绝缘层，形成在绝缘层的第一表面上的第一电路层和形成在绝缘层的第二表面上的第二电路层; 以及包括电极部分并且嵌入在所述绝缘层中的元件，其中所述电极部分与所述第一电路层接触。

公开(公告)号：US20160219710A1

公开(公告)日：2016-07-28

申请号：US15003400

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ho-Sik PARK ,  Dong-Keun LEE ,  Jae-Hoon CHOI ,  Sang-Jae LEE ,  Sung-Taek LIM

IPC: H05K1/18 ,  H05K3/40 ,  H05K3/30 ,  H05K1/03 ,  H05K3/10

Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

Abstract translation: 印刷电路板及其方法包括嵌入绝缘层中的电子部件，其包括在绝缘层的表面上露出的连接端子。 印刷电路板及其方法还包括形成在电子部件的连接端子上并暴露在绝缘层的表面上的凸块。

公开(公告)号：US20160219709A1

公开(公告)日：2016-07-28

申请号：US14990046

申请日：2016-01-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Joon-Sung LEE ,  Yong-Sam LEE ,  Seok-Hwan AHN ,  Jae-Hoon CHOI

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/186 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4697 ,  H05K2201/10 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.

Abstract translation: 公开了一种嵌入式电路板及其制造方法。 嵌入式板可以包括绝缘层，第一电路层，形成在绝缘层的内部，形成在第一电路层的上部的第二电路层，第二电路层设置在绝缘层的内部，第一电子元件设置在内部 绝缘层，第一电子元件与第二电路层间隔开，形成在第一电路层和第二电路层或第一电子元件之间的金属柱，以及形成在第二电路的上部的第一通孔 绝缘层内层。

公开(公告)号：US20160381796A1

公开(公告)日：2016-12-29

申请号：US15096993

申请日：2016-04-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Uk LEE ,  Il-Jong SEO ,  Jae-Hoon CHOI ,  Yong-Ho BAEK

IPC: H05K1/11 ,  H05K3/06

CPC classification number: H05K1/115 ,  H05K3/067 ,  H05K3/4647 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/09854 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

Abstract translation: 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层，嵌入绝缘层中的电路层，设置在绝缘层的一个表面上的阻焊层，阻焊层具有通孔形状的空腔，以暴露部分 电路层，以及嵌入到阻焊层中并经由阻焊层的开口暴露于外部的金属柱，金属柱包括第一后​​金属层，后阻挡层和第二柱 金属层。