公开(公告)号：US20160212856A1

公开(公告)日：2016-07-21

申请号：US15081108

申请日：2016-03-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Won KIM ,  Seok Kyu LEE ,  Tae Gon LEE ,  Byung Hak KANG ,  Jung Soo BYUN ,  Yeon Seop YU ,  Sang Mi YOON

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/4602 ,  H05K2203/0156 ,  H05K2203/1469 ,  H05K2203/1476 ,  Y10T29/4913

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

公开(公告)号：US20150085455A1

公开(公告)日：2015-03-26

申请号：US14496750

申请日：2014-09-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Won KIM ,  Kyoung Ro YOON ,  Bong Soo KIM ,  Jung Soo BYUN ,  Kyo Min JUNG ,  Tae Gon LEE

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/186 ,  H05K2201/09036 ,  H05K2201/09063 ,  Y10T29/49146

Abstract: Embodiments of the invention provide an electronic component-embedded substrate and a manufacturing method thereof. According to at least one embodiment, the electronic component-embedded substrate includes a cavity formed in a core substrate and including two or more embedding spaces which have a rectangular shape (when viewed on a plane) and are connected to each other by a connecting space, and two or more electronic components separately accommodated in the embedding spaces of the cavity, respectively. According to at least one embodiment, neighboring long sides of first and second embedding spaces are partially connected to each other by the connecting space, and one side (when viewed on the plane) forming a connecting width of the connecting space connecting the first and second embedding spaces to each other coincides with one short side of the first embedding space, and the other side (when viewed on the plane) coincides with the other short side of the second embedding space.

Abstract translation: 本发明的实施例提供一种电子部件嵌入式基板及其制造方法。 根据至少一个实施例，电子部件嵌入式基板包括形成在芯基板中的空腔，并且包括两个或更多个具有矩形形状的嵌入空间（当从平面观察时）并且通过连接空间彼此连接 ，以及分别容纳在空腔的嵌入空间中的两个或更多个电子部件。 根据至少一个实施例，第一和第二嵌入空间的相邻长边通过连接空间彼此部分连接，并且一侧（当在平面上观察时）形成连接第一和第二嵌入空间的连接空间的连接宽度 彼此嵌入空间与第一嵌入空间的一个短边重合，另一侧（当在平面上观察时）与第二嵌入空间的另一短边重合。