公开(公告)号：US20150085455A1

公开(公告)日：2015-03-26

申请号：US14496750

申请日：2014-09-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Won KIM ,  Kyoung Ro YOON ,  Bong Soo KIM ,  Jung Soo BYUN ,  Kyo Min JUNG ,  Tae Gon LEE

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/186 ,  H05K2201/09036 ,  H05K2201/09063 ,  Y10T29/49146

Abstract: Embodiments of the invention provide an electronic component-embedded substrate and a manufacturing method thereof. According to at least one embodiment, the electronic component-embedded substrate includes a cavity formed in a core substrate and including two or more embedding spaces which have a rectangular shape (when viewed on a plane) and are connected to each other by a connecting space, and two or more electronic components separately accommodated in the embedding spaces of the cavity, respectively. According to at least one embodiment, neighboring long sides of first and second embedding spaces are partially connected to each other by the connecting space, and one side (when viewed on the plane) forming a connecting width of the connecting space connecting the first and second embedding spaces to each other coincides with one short side of the first embedding space, and the other side (when viewed on the plane) coincides with the other short side of the second embedding space.

Abstract translation: 本发明的实施例提供一种电子部件嵌入式基板及其制造方法。 根据至少一个实施例，电子部件嵌入式基板包括形成在芯基板中的空腔，并且包括两个或更多个具有矩形形状的嵌入空间（当从平面观察时）并且通过连接空间彼此连接 ，以及分别容纳在空腔的嵌入空间中的两个或更多个电子部件。 根据至少一个实施例，第一和第二嵌入空间的相邻长边通过连接空间彼此部分连接，并且一侧（当在平面上观察时）形成连接第一和第二嵌入空间的连接空间的连接宽度 彼此嵌入空间与第一嵌入空间的一个短边重合，另一侧（当在平面上观察时）与第二嵌入空间的另一短边重合。

公开(公告)号：US20150049445A1

公开(公告)日：2015-02-19

申请号：US14156837

申请日：2014-01-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Won KIM ,  Seok Kyu Lee ,  Tae Gon Lee ,  Byung Hak Kang ,  Jung Soo Byun ,  Yeon Seop Yu ,  Sang Mi Yoon

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/4602 ,  H05K2203/0156 ,  H05K2203/1469 ,  H05K2203/1476 ,  Y10T29/4913

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

Abstract translation: 这里公开了电子部件嵌入基板和电子部件嵌入基板的制造方法。 电子部件嵌入基板的制造方法包括：将电子部件插入形成在芯基板中的空腔中; 在芯基板的一侧上堆叠第一绝缘层，电子部件插入其中; 在芯基板的与堆叠第一绝缘层的方向相反的另一侧进行表面处理，以改善至少第一绝缘层的暴露表面的表面粗糙度; 并且在所述芯基板的另一侧堆叠第二绝缘层，以便结合到表面粗糙度得到改善的第一绝缘层的暴露表面。 另外，这里公开的是电子部件嵌入基板。

公开(公告)号：US20170263573A1

公开(公告)日：2017-09-14

申请号：US15352668

申请日：2016-11-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Won KIM ,  Tae Sung JEONG

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A fan-out semiconductor package includes a redistribution layer, an interconnection member, a semiconductor chip, and a protective layer. The interconnection member has a through hole disposed on the redistribution layer. The semiconductor chip is disposed on the redistribution layer exposed within the through hole. The protective layer is formed between the redistribution layer and the interconnection member, and coupled to the interconnection member to protect the interconnection member.

公开(公告)号：US20160212856A1

公开(公告)日：2016-07-21

申请号：US15081108

申请日：2016-03-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Won KIM ,  Seok Kyu LEE ,  Tae Gon LEE ,  Byung Hak KANG ,  Jung Soo BYUN ,  Yeon Seop YU ,  Sang Mi YOON

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/4602 ,  H05K2203/0156 ,  H05K2203/1469 ,  H05K2203/1476 ,  Y10T29/4913

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

公开(公告)号：US20140298648A1

公开(公告)日：2014-10-09

申请号：US14308898

申请日：2014-06-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Won KIM ,  Tae Sung JEONG

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/185 ,  H05K3/007 ,  Y10T29/49139 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Embodiments of the invention provide a method of manufacturing an electronic component-embedded printed circuit board. The method includes the steps of providing a base plate, which has a cavity formed in a thickness direction thereof and to one side of which tape is adhered, and disposing an electronic component in the cavity, such that an active surface of the electronic component is flush with one side of the base plate. The method further includes forming an insulating material layer on the other side of the base plate to bury the electronic component, and removing the tape from the one side of the base plate and then forming a first circuit layer including connection patterns coming into contact with connecting terminals of the electronic component on the one side of the base plate.

Abstract translation: 本发明的实施例提供一种制造嵌入电子元件的印刷电路板的方法。 该方法包括以下步骤：提供基板，其具有在其厚度方向上形成的空腔和粘合带的一侧，并且将电子部件设置在空腔中，使得电子部件的有效表面为 与基板的一侧齐平。 该方法还包括在基板的另一侧上形成绝缘材料层以埋置电子部件，并且从基板的一侧移除带，然后形成包括与连接的接触的连接图案的第一电路层 电子部件的端子在基板的一侧。

公开(公告)号：US20130056141A1

公开(公告)日：2013-03-07

申请号：US13668634

申请日：2012-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Joon Seok KANG ,  Young Do KWEON ,  Hong Won KIM ,  Jingli YUAN

IPC: B32B38/00

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3171 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized

Abstract translation: 本文公开了一种包括封装模具的模具封装，包括：一个模具，其在其一侧包括焊盘; 覆盖所述管芯的侧面的封装层; 覆盖该封装层和该芯片的一侧的支撑层; 钝化层，形成在所述管芯的另一侧上，使得所述焊盘暴露在其中; 以及形成在钝化层上的再分配层，使得其一部分与焊盘连接。 这里，由于模具的一侧由支撑层支撑，并且仅在模具的侧面形成封装层，因此可以将由于热膨胀系数的差异导致的模具封装的翘曲最小化