公开(公告)号：US20190386641A1

公开(公告)日：2019-12-19

申请号：US16190573

申请日：2018-11-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung LEE ,  Tae Yoon KIM ,  Jong Woon KIM ,  Moon Chul LEE ,  Yong Jin KANG ,  Nam Jung LEE

IPC: H03H9/17 ,  H03H9/58 ,  H03H9/13 ,  H03H3/02

Abstract: An acoustic resonator includes a substrate, and a resonant portion comprising a center portion in which a first electrode, a piezoelectric layer and a second electrode are sequentially laminated on the substrate, and an extending portion disposed along a periphery of the center portion, wherein the resonant portion is configured to have an asymmetrical polygonal plane, an insertion layer is disposed below the piezoelectric layer in the extending portion, and the piezoelectric layer is configured to have a top surface which is raised to conform to a shape of the insertion layer, and the insertion layer is configured to have an asymmetrical polygonal shape corresponding to a shape of the extending portion.

公开(公告)号：US20180062620A1

公开(公告)日：2018-03-01

申请号：US15462110

申请日：2017-03-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung LEE ,  Yong Jin KANG ,  Moon Chul LEE ,  Jae Hyoung GIL ,  Chang Hyun LIM ,  Tae Yoon KIM

IPC: H03H9/60 ,  H03H9/54 ,  H01L41/047

CPC classification number: H03H9/60 ,  H01L41/0477 ,  H03H3/02 ,  H03H9/547

Abstract: A bulk-acoustic wave filter device includes: a lower electrode layer disposed on the substrate; a bonding part disposed on the lower electrode layer, at an edge of the substrate; a ground part spaced apart from the bonding part; and a flow suppressing part disposed between the bonding part and the ground part, and offset with respect to the bonding part and the ground part.