公开(公告)号：US09997850B2

公开(公告)日：2018-06-12

申请号：US15073017

申请日：2016-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-Seok Hong ,  Won-Seob Kim

IPC: H01R12/71 ,  H05K1/11 ,  H01R12/72 ,  H01R107/00

CPC classification number: H01R12/716 ,  H01R12/724 ,  H01R2107/00 ,  H04M1/0274 ,  H05K1/111 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: An electronic device is provided. The electronic device includes a circuit board including multiple lands arranged on a surface, and an electrical receptacle including multiple contacts electrically connected to the multiple lands, the electrical receptacle being installed on the circuit board, where at least two contacts are connected to at least one land among the multiple lands.

公开(公告)号：US11038547B2

公开(公告)日：2021-06-15

申请号：US16321413

申请日：2017-07-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Hyangbok Lee ,  Byoung-Ryoul Song ,  Taelee Lee ,  Soonheung Kwon ,  Min-Seok Kim ,  Won-Seob Kim ,  Yoon-Goo Nam ,  Sung-Soo Kim ,  Sigwan Kim ,  Seung-Hwa Shin ,  Taekkyun Choi ,  Young Heo

IPC: H04B1/401 ,  H04B7/0404

Abstract: Various examples of the present invention relate to a device and a method for improving wireless communication performance in an electronic device. The electronic device comprises multiple antennas, a communication circuit connected to the multiple antennas, a connector, and at least one processor, wherein the processor checks whether a wired cable is connected through the connector and, if the wired cable is connected through the connector, can perform control such that communication using the multiple antennas corresponding to the connection of the wired cable is performed. Other examples can be possible.

公开(公告)号：US20150063505A1

公开(公告)日：2015-03-05

申请号：US14304807

申请日：2014-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Seob Kim ,  Gyoung-Hwan Park ,  Dong-Ho Yu ,  Woo-Sung Jang ,  Eun-Seok Hong

IPC: H04B7/08 ,  H03G1/00

CPC classification number: H03G1/0017 ,  H03G3/002

Abstract: An apparatus for compensating for channel loss in an electronic includes a resistor configured to increase an output voltage swing level, and a connector configured to receive a data signal, to compensate for channel loss of the received data signal by amplifying the received data signal, and to output the amplified data signal.

Abstract translation: 一种用于补偿电子设备中的信道损耗的装置包括：一个电阻器，用于增加一个输出电压摆幅电平;一个连接器被配置为接收一个数据信号，以通过放大接收的数据信号来补偿接收的数据信号的信道损耗;以及 以输出放大的数据信号。

公开(公告)号：US20160344120A1

公开(公告)日：2016-11-24

申请号：US15073017

申请日：2016-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-Seok HONG ,  Won-Seob Kim

IPC: H01R12/71 ,  H05K1/11 ,  H01R24/60

CPC classification number: H01R12/716 ,  H01R12/724 ,  H01R2107/00 ,  H04M1/0274 ,  H05K1/111 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: An electronic device is provided. The electronic device includes a circuit board including multiple lands arranged on a surface, and an electrical receptacle including multiple contacts electrically connected to the multiple lands, the electrical receptacle being installed on the circuit board, where at least two contacts are connected to at least one land among the multiple lands.

Abstract translation: 提供电子设备。 电子设备包括电路板，其包括布置在表面上的多个焊盘，以及电插座，其包括电连接到多个焊盘的多个触点，电插座安装在电路板上，其中至少两个触点连接到至少一个 土地在多个土地之间。

公开(公告)号：US20150064956A1

公开(公告)日：2015-03-05

申请号：US14223877

申请日：2014-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Seob Kim ,  Jun-Hwan Lee ,  Myung-Keun Seo ,  Jung-Je Bang ,  Eun-Seok Hong ,  Ji-Nyeon Kim ,  Seung-Hyun Lee

IPC: H01R29/00

CPC classification number: H01R27/00

Abstract: A connector device includes one or more connection terminals, and a shell housing provided with a body receiving one or more connection terminals, and fixing portions formed as one piece with the body and fixed to a substrate. A standard mode typed connector device includes the connection terminals mounted to be close to an upper surface in the body. A reverse mode typed connector device includes the connection terminals mounted to be close to a bottom surface of the body. Also other embodiments of the connector device are disclosed.

Abstract translation: 连接器装置包括一个或多个连接端子，壳体壳体设置有容纳一个或多个连接端子的主体，以及与主体形成为一体并固定到基板的固定部分。 标准模式型连接器装置包括安装在本体内靠近上表面的连接端子。 反向模式型连接器装置包括安装成接近主体底面的连接端子。 还公开了连接器装置的其它实施例。