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公开(公告)号：US11929768B2
公开(公告)日：2024-03-12
申请号：US16976907
申请日：2020-07-31
发明人： Yoondo Lee , Sigwan Kim , Hyelee Song , Dongryul Shin , Dongmin Shin , Yoonjae Lee , Handug Lee , Woosik Cho , Weonjai Choi , Taewook Ham , Kyunggu Kim , Hongpyo Bae , Jinwoo Jung , Youngjun Cho
CPC分类号： H04B1/0064 , H01Q1/243 , H01Q5/50 , H01Q21/08 , H05K1/0243 , H05K1/0277 , H05K7/1427 , H05K2201/10098
摘要： In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.
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公开(公告)号：US11038547B2
公开(公告)日：2021-06-15
申请号：US16321413
申请日：2017-07-13
发明人： Hyangbok Lee , Byoung-Ryoul Song , Taelee Lee , Soonheung Kwon , Min-Seok Kim , Won-Seob Kim , Yoon-Goo Nam , Sung-Soo Kim , Sigwan Kim , Seung-Hwa Shin , Taekkyun Choi , Young Heo
IPC分类号： H04B1/401 , H04B7/0404
摘要： Various examples of the present invention relate to a device and a method for improving wireless communication performance in an electronic device. The electronic device comprises multiple antennas, a communication circuit connected to the multiple antennas, a connector, and at least one processor, wherein the processor checks whether a wired cable is connected through the connector and, if the wired cable is connected through the connector, can perform control such that communication using the multiple antennas corresponding to the connection of the wired cable is performed. Other examples can be possible.
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3.发明授权公开(公告)号：US10355415B2
公开(公告)日：2019-07-16
申请号：US15916505
申请日：2018-03-09
发明人： Hyung Joon Kim , Min-Seok Kim , Sigwan Kim , Jung-Woo Kim
IPC分类号： H01R13/648 , H05K1/02 , H01R13/6471 , H01R13/6466 , H01R13/66 , H01R12/72
摘要： An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.
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4.发明申请公开(公告)号：US20180287302A1
公开(公告)日：2018-10-04
申请号：US15916505
申请日：2018-03-09
发明人： Hyung Joon Kim , Min-Seok Kim , Sigwan Kim , Jung-Woo Kim
IPC分类号： H01R13/6471 , H05K1/02 , H01R12/72 , H01R13/6466 , H01R13/66
CPC分类号： H01R13/6471 , H01R12/721 , H01R13/6466 , H01R13/6691 , H01R2201/16 , H05K1/0215 , H05K1/0218 , H05K1/0298 , H05K2201/0715 , H05K2201/095 , H05K2201/10189
摘要： An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.
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