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公开(公告)号：US20250105128A1
公开(公告)日：2025-03-27
申请号：US18745694
申请日：2024-06-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungjoon Yoo , Jungmin Seo , Kiwhan Song , Hanbyeol Lee
IPC: H01L23/498 , H01L23/00 , H01L25/065
Abstract: A semiconductor package includes a package substrate having a plurality of substrate pads, a chip stack including a plurality of semiconductor chips each chip having a plurality of chip pads arranged along one edge of an upper surface and pad extensions extending from the plurality of chip pads to an adjacent side surface to the one edge. The semiconductor chips are stacked such that the adjacent side surfaces have a coplanar surface. A multichannel film having an insulating film and a plurality of conductive lines disposed connects the chip pads of the plurality of semiconductor chips to the plurality of substrate pads.
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公开(公告)号：US20230307068A1
公开(公告)日：2023-09-28
申请号：US18184842
申请日：2023-03-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yoonjae LEE , Byungjoon Yoo , Chiweon Yoon , Cheonan Lee
Abstract: A memory device includes a memory cell array region electrically connected to a plurality of word lines and a plurality of bit lines and the memory cell array including a plurality of memory cells, and a peripheral circuit region under the memory cell array region, wherein the memory cell array region and the peripheral circuit region are electrically connected by through vias, the peripheral circuit region includes a voltage generator configured to generate an operating voltage to apply to the word lines, the voltage generator includes a pumping capacitor unit configured to charge and pump a voltage based on a clock signal, and a signal controller configured to control the clock signal and a current flowing through the pumping capacitor unit, the signal controller includes a clock driver configured to apply a clock signal to the pumping capacitor, and the signal controller is adjacent to the through vias.
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