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公开(公告)号:US11764064B2
公开(公告)日:2023-09-19
申请号:US17479256
申请日:2021-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam Hoon Lee , Ill Hyun Park , Tae Hee Han , Jin Won Ma , Byung Joo Oh , Bong Ju Lee , Jae Hee Lee , Joo Yong Lee , Nam Ki Cho , Chang Seong Hong
IPC: G01N21/25 , H01L21/268 , B23K26/354 , H01L21/67 , H01L21/66 , B23K26/03
CPC classification number: H01L21/268 , B23K26/032 , B23K26/354 , G01N21/25 , H01L21/67248 , H01L22/12
Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.
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公开(公告)号:US11158510B2
公开(公告)日:2021-10-26
申请号:US16393232
申请日:2019-04-24
Applicant: Samsung Electronics Co., Ltd. , EO Technics Co., LTD
Inventor: Nam Hoon Lee , Ill Hyun Park , Tae Hee Han , Jin Won Ma , Byung Joo Oh , Bong Ju Lee , Jae Hee Lee , Joo Yong Lee , Nam Ki Cho , Chang Seong Hong
IPC: G01N21/25 , H01L21/268 , B23K26/354 , H01L21/67 , H01L21/66 , B23K26/03
Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.
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