公开(公告)号：US11158510B2

公开(公告)日：2021-10-26

申请号：US16393232

申请日：2019-04-24

Applicant: Samsung Electronics Co., Ltd. ,  EO Technics Co., LTD

Inventor： Nam Hoon Lee ,  Ill Hyun Park ,  Tae Hee Han ,  Jin Won Ma ,  Byung Joo Oh ,  Bong Ju Lee ,  Jae Hee Lee ,  Joo Yong Lee ,  Nam Ki Cho ,  Chang Seong Hong

IPC: G01N21/25 ,  H01L21/268 ,  B23K26/354 ,  H01L21/67 ,  H01L21/66 ,  B23K26/03

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

公开(公告)号：US10262841B2

公开(公告)日：2019-04-16

申请号：US15402749

申请日：2017-01-10

Applicant: Samsung Electronics Co., Ltd. ,  Nanotech Inc.

Inventor： Pyung Moon ,  Sung Ho Kang ,  Ki Chul Kim ,  Un Ki Kim ,  Yong Hun Lee ,  Jae Hee Lee ,  Yong Seok Song ,  Hang Mook Park ,  Je Hoon Oh

IPC: H01J37/32 ,  H05B37/02

Abstract: A plasma monitoring device includes a fixing unit, a plasma measuring unit disposed to be in contact with the fixing unit, and measuring a luminous intensity of emitted light of a plasma to output a luminous intensity measurement value, a reference light source unit irradiating reference light having a uniform luminous intensity to the plasma measuring unit, and a control unit receiving the luminous intensity measurement value to calculate a luminous intensity value of the emitted light, controlling a voltage applied to the reference light source unit to uniformly control a luminous intensity of the reference light, comparing a luminous intensity of the reference light irradiated to the plasma measuring unit with a previously stored luminous intensity reference value to detect a correction factor, and applying the correction factor to a luminous intensity value of the emitted light to correct the luminous intensity measurement value.

公开(公告)号：US20180012737A1

公开(公告)日：2018-01-11

申请号：US15402749

申请日：2017-01-10

Applicant: Samsung Electronics Co., Ltd. ,  Nanotech Inc.

Inventor： Pyung Moon ,  Sung Ho Kang ,  Ki Chul Kim ,  Un Ki Kim ,  Yong Hun Lee ,  Jae Hee Lee ,  Yong Seok Song ,  Hang Mook Park ,  Je Hoon Oh

IPC: H01J37/32 ,  H05B37/02

CPC classification number: H01J37/32935 ,  H05B37/0227

Abstract: A plasma monitoring device includes a fixing unit, a plasma measuring unit disposed to be in contact with the fixing unit, and measuring a luminous intensity of emitted light of a plasma to output a luminous intensity measurement value, a reference light source unit irradiating reference light having a uniform luminous intensity to the plasma measuring unit, and a control unit receiving the luminous intensity measurement value to calculate a luminous intensity value of the emitted light, controlling a voltage applied to the reference light source unit to uniformly control a luminous intensity of the reference light, comparing a luminous intensity of the reference light irradiated to the plasma measuring unit with a previously stored luminous intensity reference value to detect a correction factor, and applying the correction factor to a luminous intensity value of the emitted light to correct the luminous intensity measurement value.

公开(公告)号：US09472740B2

公开(公告)日：2016-10-18

申请号：US14612049

申请日：2015-02-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Wan Seo ,  Kun Yoo Ko ,  Jae Hee Lee

IPC: H01L29/49 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting diode (LED) package may include a package body provided with a pair of lead frames, and an LED chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the LED chip is disposed and a second reflective layer disposed on the first reflective layer. A wire may penetrate through the second reflective layer to be connected to the first reflective layer. Accordingly, the LED package may provide the uniform amount of light by suppressing discoloration of the lead frames, and the manufacturing time of the LED package may be reduced, leading to a reduction in manufacturing costs.

Abstract translation: 发光二极管（LED）封装可以包括设置有一对引线框的封装体和安装在封装主体上并通过引线接合电连接到引线框的LED芯片。 每个引线框架可以包括设置在其上设置LED芯片的安装表面上的第一反射层和设置在第一反射层上的第二反射层。 导线可穿透第二反射层以连接到第一反射层。 因此，LED封装可以通过抑制引线框架的变色来提供均匀的光量，并且可以减少LED封装的制造时间，导致制造成本的降低。

公开(公告)号：US11764064B2

公开(公告)日：2023-09-19

申请号：US17479256

申请日：2021-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Hoon Lee ,  Ill Hyun Park ,  Tae Hee Han ,  Jin Won Ma ,  Byung Joo Oh ,  Bong Ju Lee ,  Jae Hee Lee ,  Joo Yong Lee ,  Nam Ki Cho ,  Chang Seong Hong

IPC: G01N21/25 ,  H01L21/268 ,  B23K26/354 ,  H01L21/67 ,  H01L21/66 ,  B23K26/03

CPC classification number: H01L21/268 ,  B23K26/032 ,  B23K26/354 ,  G01N21/25 ,  H01L21/67248 ,  H01L22/12

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

公开(公告)号：US20160027977A1

公开(公告)日：2016-01-28

申请号：US14612049

申请日：2015-02-02

Applicant: SAMSUNG ELECTRONICS CO. LTD.

Inventor： Jong Wan SEO ,  Kun Yoo Ko ,  Jae Hee Lee

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting diode (LED) package may include a package body provided with a pair of lead frames, and an LED chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the LED chip is disposed and a second reflective layer disposed on the first reflective layer. A wire may penetrate through the second reflective layer to be connected to the first reflective layer. Accordingly, the LED package may provide the uniform amount of light by suppressing discoloration of the lead frames, and the manufacturing time of the LED package may be reduced, leading to a reduction in manufacturing costs.

Abstract translation: 发光二极管（LED）封装可以包括设置有一对引线框的封装体和安装在封装主体上并通过引线接合电连接到引线框的LED芯片。 每个引线框架可以包括设置在其上设置LED芯片的安装表面上的第一反射层和设置在第一反射层上的第二反射层。 导线可穿透第二反射层以连接到第一反射层。 因此，LED封装可以通过抑制引线框架的变色来提供均匀的光量，并且可以减少LED封装的制造时间，导致制造成本的降低。