公开(公告)号：US20190064219A1

公开(公告)日：2019-02-28

申请号：US15871561

申请日：2018-01-15

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute Of Science And Technology

Inventor： Min-woo Rhee ,  Duke Kimm ,  Jae-hong Kim ,  Ji-nyeong Yun ,  In-kyu Park ,  Jun-bo Yoon ,  Dong-uk Kwon ,  Seung-hwan Kim ,  Chang-keun Kim ,  Yong-hoon Yoon

IPC: G01R1/073 ,  H01R13/24 ,  G01R31/28 ,  G01R1/067

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

公开(公告)号：US10514392B2

公开(公告)日：2019-12-24

申请号：US15871561

申请日：2018-01-15

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute Of Science And Technology

Inventor： Min-woo Rhee ,  Duke Kimm ,  Jae-hong Kim ,  Ji-nyeong Yun ,  In-kyu Park ,  Jun-bo Yoon ,  Dong-uk Kwon ,  Seung-hwan Kim ,  Chang-keun Kim ,  Yong-hoon Yoon

IPC: G01R31/10 ,  G01R1/073 ,  G01R1/067 ,  H01R13/24 ,  G01R31/28 ,  H01R11/18 ,  H01R12/57 ,  H01R12/52 ,  H01R12/70 ,  H01R12/71

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

公开(公告)号：US11586015B2

公开(公告)日：2023-02-21

申请号：US16648290

申请日：2018-08-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-seon Seo ,  Chang-keun Kim ,  Sang-yong Jeon

IPC: G02B13/00 ,  G02B9/62 ,  G03B17/12

Abstract: The optical lens assembly may include a first lens having a negative refractive power, a second lens having a positive refractive power, a third lens having a negative refractive power, a fourth lens having a refractive power, a fifth lens having a refractive power, a sixth lens having a negative refractive power, and a stop disposed at an object side of the first lens.

公开(公告)号：US09335527B2

公开(公告)日：2016-05-10

申请号：US14299405

申请日：2014-06-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang-keun Kim ,  Jung-hoi Ko

IPC: G02B9/34 ,  G02B15/16 ,  G02B15/173 ,  G02B13/00 ,  H04N5/232

CPC classification number: G02B15/16 ,  G02B13/009 ,  G02B15/173 ,  H04N5/23296

Abstract: A zoom lens includes: in an order from an object side to an image side, a first lens group having a positive refractive power; a second lens group having a negative refractive power; a third lens group having a positive refractive power; and a fourth lens group having a positive refractive power, wherein, when zooming is performed from a wide angle position to a telephoto position, the first through fourth lens groups move, and the first lens group includes a first negative lens and a second positive lens from the object side. The zoom lens may be part of an electronic apparatus, such as a photographing apparatus.

Abstract translation: 变焦透镜包括：从物体侧到像侧的顺序，具有正折射光焦度的第一透镜组; 具有负屈光力的第二透镜组; 具有正屈光力的第三透镜组; 以及具有正折光力的第四透镜组，其中当从广角位置到远摄位置进行变焦时，第一至第四透镜组移动，并且第一透镜组包括第一负透镜和第二正透镜 从物体侧。 变焦镜头可以是电子设备的一部分，例如摄影设备。

公开(公告)号：US20150153548A1

公开(公告)日：2015-06-04

申请号：US14299405

申请日：2014-06-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang-keun Kim ,  Jung-hoi Ko

IPC: G02B15/16 ,  H04N5/232 ,  G02B13/00

CPC classification number: G02B15/16 ,  G02B13/009 ,  G02B15/173 ,  H04N5/23296

Abstract: A zoom lens includes: in an order from an object side to an image side, a first lens group having a positive refractive power; a second lens group having a negative refractive power; a third lens group having a positive refractive power; and a fourth lens group having a positive refractive power, wherein, when zooming is performed from a wide angle position to a telephoto position, the first through fourth lens groups move, and the first lens group includes a first negative lens and a second positive lens from the object side. The zoom lens may be part of an electronic apparatus, such as a photographing apparatus.

Abstract translation: 变焦透镜包括：从物体侧到像侧的顺序，具有正折射光焦度的第一透镜组; 具有负屈光力的第二透镜组; 具有正屈光力的第三透镜组; 以及具有正折光力的第四透镜组，其中当从广角位置到远摄位置进行变焦时，第一至第四透镜组移动，并且第一透镜组包括第一负透镜和第二正透镜 从物体侧。 变焦透镜可以是电子设备的一部分，例如摄影设备。