APPARATUS FOR POLISHING A WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20230170222A1

    公开(公告)日:2023-06-01

    申请号:US17842962

    申请日:2022-06-17

    CPC classification number: H01L21/30625 B24B37/042 B24B57/02

    Abstract: A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the second region, turning the polishing pad to polish a surface of the wafer, and unloading the wafer from the polishing pad after polishing on the surface of the wafer is completed, wherein the fence includes a first fence extending from a center of the polishing pad toward an edge of the polishing pad in a first horizontal direction, and a second fence extending from the center of the polishing pad toward the edge of the polishing pad in a second horizontal direction different from the first horizontal direction.

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