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公开(公告)号:US20220301969A1
公开(公告)日:2022-09-22
申请号:US17505953
申请日:2021-10-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunggyun NOH , GUN-HEE BAE , SANGWOO PAE , JINSOO BAE , DEOK-SEON CHOI , IL-JOO CHOI
IPC: H01L23/367 , H01L23/22 , H01L23/40
Abstract: A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.
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公开(公告)号:US20240429111A1
公开(公告)日:2024-12-26
申请号:US18432463
申请日:2024-02-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunggyun NOH , JINSOO BAE , KEUN-HO RHEW , DEOK-SEON CHOI , Jongchan CHOE
Abstract: A semiconductor memory module is disclosed. The semiconductor memory module includes a first substrate including a first corner, first semiconductor packages mounted on a lower surface of the first substrate, a second substrate disposed over the first substrate and including a second corner corresponding to the first corner, second semiconductor packages mounted on an upper surface of the second substrate, and a fixing structure in which the first corner and the second corner are fitted.
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