公开(公告)号：US20220301969A1

公开(公告)日：2022-09-22

申请号：US17505953

申请日：2021-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunggyun NOH ,  GUN-HEE BAE ,  SANGWOO PAE ,  JINSOO BAE ,  DEOK-SEON CHOI ,  IL-JOO CHOI

IPC: H01L23/367 ,  H01L23/22 ,  H01L23/40

Abstract: A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.