公开(公告)号：US20230028943A1

公开(公告)日：2023-01-26

申请号：US17680877

申请日：2022-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNGGYUN NOH ,  SANGWOO PAE ,  JINSOO BAE ,  ILJOO CHOI ,  DEOKSEON CHOI ,  KEUNHO RHEW

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes; a package substrate including an upper surface with a bonding pad, a lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the lower semiconductor chip includes a connect edge region including a connection pad and an open edge region including a dam structure including dummy bumps, a bonding wire having a first height above the upper surface of the lower semiconductor chip and connecting the bonding pad and the connection pad, an upper semiconductor chip disposed on the upper surface of the lower semiconductor chip using an inter-chip bonding layer, and a molding portion on the package substrate and substantially surrounding the lower semiconductor chip and the upper semiconductor chip.

公开(公告)号：US20240429111A1

公开(公告)日：2024-12-26

申请号：US18432463

申请日：2024-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunggyun NOH ,  JINSOO BAE ,  KEUN-HO RHEW ,  DEOK-SEON CHOI ,  Jongchan CHOE

IPC: H01L23/24 ,  H01L23/00 ,  H01L23/36 ,  H10B80/00

Abstract: A semiconductor memory module is disclosed. The semiconductor memory module includes a first substrate including a first corner, first semiconductor packages mounted on a lower surface of the first substrate, a second substrate disposed over the first substrate and including a second corner corresponding to the first corner, second semiconductor packages mounted on an upper surface of the second substrate, and a fixing structure in which the first corner and the second corner are fitted.

公开(公告)号：US20240231611A9

公开(公告)日：2024-07-11

申请号：US18337790

申请日：2023-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEWOONG CHOI ,  DONGYOUNG LEE ,  DASOL PARK ,  JINSOO BAE

IPC: G06F3/06

CPC classification number: G06F3/0604 ,  G06F3/0653 ,  G06F3/0673

Abstract: A storage device may include a memory, a humidity sensor that collects humidity information of the storage device, and a storage controller that performs a heating operation set to increase a temperature of the storage device through the memory if a humidity value of the humidity information exceeds a reference humidity value.

公开(公告)号：US20240134520A1

公开(公告)日：2024-04-25

申请号：US18337790

申请日：2023-06-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEWOONG CHOI ,  DONGYOUNG LEE ,  DASOL PARK ,  JINSOO BAE

IPC: G06F3/06

CPC classification number: G06F3/0604 ,  G06F3/0653 ,  G06F3/0673

Abstract: A storage device may include a memory, a humidity sensor that collects humidity information of the storage device, and a storage controller that performs a heating operation set to increase a temperature of the storage device through the memory if a humidity value of the humidity information exceeds a reference humidity value.

公开(公告)号：US20220301969A1

公开(公告)日：2022-09-22

申请号：US17505953

申请日：2021-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunggyun NOH ,  GUN-HEE BAE ,  SANGWOO PAE ,  JINSOO BAE ,  DEOK-SEON CHOI ,  IL-JOO CHOI

IPC: H01L23/367 ,  H01L23/22 ,  H01L23/40

Abstract: A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.